Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

ISES Docs:
  • The anticipated growth of Semiconductor Industry by 2030
  • The role of Advanced Packaging to support the scale of Moore’s Law
  • Roadmap for advanced packaging for Intel
  • How is advanced Packaging factory setup different vs traditional Assembly Test Factory
  • Challenges in building a fab in Malaysia
  • Collaboration opportunities for vendors and Malaysia to make the industry more effective and level the playing field
  • Conclusion
Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel Corporation

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