In our digital-driven society the increasing importance of information, automation and hence data processing requires the next generation of faster and smaller semiconductor devices. Metallization processes play a crucial role in enabling the newest interconnects and are hence of high importance for further technological advances. Requirements such as reliability, functionality and downsizing are thus common targets of semiconductor devices as well as plating processes.

We will present some of MKS Atotech’s new solutions for advanced packaging, such as Cu-to-Cu direct bonding as well as new processes for SnAg solder bump plating. Additionally, we will give insights into our offerings for highly reliable Si- and SiC-based Power Semiconductors.