Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond

ISES Docs:

For many years organic substates have provided the most cost effective solution to enable the heterogeneous integration of chiplets. However, as the substrate interconnect density increases, there has been a paradigm shift in the package architecture to replace organic substrates with glass core substrates. This talk will discuss the benefits and challenges of both architectures and explores the possibility of extending the useful life of organic substrates beyond 5 µm l/s.

Keith Best photo

Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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