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Unleashing the Power of AI: Opportunities and Challenges Ahead

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Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron

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Opening Address

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Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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EVATEC – Mastering Deposition Technologies from Core to Package

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Maurus Tschirky

Senior Strategic Marketing Manager

Evatec

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

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Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

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Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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Wall Street Perspectives on the Semiconductor Market

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Tom Stokes

Senior Managing Director

Evercore

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Si Schottky Photodiodes: New Horizons for Short Wavelength Infrared (SWIR) Sensing

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Dr. Sandro Koch

Business Unit Manager Acoustic Sensors and Systems

Fraunhofer IPMS

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Greater Phoenix: Semiconductor Excellence on the Global Stage

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Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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Greater Phoenix: A Global Destination for Industrial Innovation

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Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

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Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

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Advanced Packaging – the Need for Standards

Dr. Shekhar Chandrashekhar photo

Dr. Shekhar Chandrashekhar

CEO

iNEMI

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Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics

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Dr. Gunar Lorenz

Sr Director Technical Marketing and Application Engineering for Consumer Sensors

Infineon Technologies AG

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The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

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Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

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Fu Lu Shou – The Three Lucky Stars of Power

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Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

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Zero Emission Becomes Real in Next-Generation Mobility

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CS Chua

President & Managing Director

Infineon Technologies AG

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Mass Manufacturing 8-inch GaN-on-Si Power Devices: the Next Generation of Power Switching Technology

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Denis Marcon

General Manager

Innoscience

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Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured

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Denis Marcon

General Manager

Innoscience

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Advanced Packaging Ecosystem

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Dr. Babak Sabi

SVP & GM Assembly and Test Technology Development

Intel

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Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

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Teng Chow Ooi

Sr Director Program Office

Intel

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Doubling Charge Speed And Cycle Life Of The Most Common Batteries With A Revolutionary Charging Algorithm, Enabled By Semiconductors Technologies

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Sunil Banwari

COO

iontra

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ISES China 2023 Post Show Report

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ISES EU Power 2023_Event Agenda

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ISES Middle East 2023 Agenda

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ISES POWER EU 2023-Post Show Report

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ISES SEA 2023 Agenda

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ISES SEA 2023 Post Show Report

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ISES Taiwan 2023 – Agenda

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ISES Taiwan 2023 – Post Show Report

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ISES USA 2023 Agenda

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ISES USA 2023 Post Show Report

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Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

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Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

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Heterogeneous Integration Enabled by Advanced Chiplet Packaging

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Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

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Semiconductor Innovations Across a More Diversified End Market

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Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Optimizing Interconnect Density with New Packaging Technologies

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Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Process Control Trends for WBG Power Devices

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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