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CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Update

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Dan Berger

Associate Director

CHIPS for America R&D Office

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The future of Advanced Packaging Inspection is X-ray

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Enrico Härtel

Director Global Key Account Management

Comet

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Glass Substrates for Advanced Packaging

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Dr. Xavier Lafosse

Commercial Technology Director, Advanced Optics

Corning Advanced Optics

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The EDA breakthrough solution for SiC and GaN Front-End and Back-End

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Luca Lillacci

General Manager

EDA Industries

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A IoT Based Solution for Gas Leak Map

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Pierre Jallon

CTO

eLichens

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Mix and Matching Chiplets with the Economics of PCB Design

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Ramin Farjadrad

Co-Founder & CEO

Eliyan

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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

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Laurent Giai-Miniet

CEO

ERS Electronic GmbH

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Unleashing the Power of AI: Opportunities and Challenges Ahead

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Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

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Opening Address

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Lucilla Sioli

Director Artificial Intelligence and Digital Industry

EU Commission

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

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Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

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Thin Film Solutions for Wide Bang Gap (WBG) Power Devices

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Dr. Vinoth Sundaramoorthy

Product Marketing Manager

Evatec

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EVATEC – Mastering Deposition Technologies from Core to Package

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Maurus Tschirky

Senior Strategic Marketing Manager

Evatec

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Wall Street Perspectives on the Semiconductor Market

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Tom Stokes

Senior Managing Director

Evercore

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Si Schottky Photodiodes: New Horizons for Short Wavelength Infrared (SWIR) Sensing

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Dr. Sandro Koch

Business Unit Manager Acoustic Sensors and Systems

Fraunhofer IPMS

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Greater Phoenix: A Global Destination for Industrial Innovation

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Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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Greater Phoenix: Semiconductor Excellence on the Global Stage

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Chris Camacho

President & CEO

Greater Phoenix Economic Council (GPEC)

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Power Semiconductors Trends in eMobility from a Broader Power Electronics Perspective

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Dr. Rainer Kaesmaier

Managing Director, Global Product Group Semiconductors

Hitachi Energy Ltd.

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Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle

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Mario Morales

Group VP, Enabling Technologies and Semiconductors

IDC

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Advanced Packaging – the Need for Standards

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Dr. Shekhar Chandrashekhar

CEO

iNEMI

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The European Chips Act. A Framework for Revitalizing the European Semiconductor Ecosystem

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Dr. Thomas Morgenstern

EVP Frontend IFAG FE

Infineon Technologies AG

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Fu Lu Shou – The Three Lucky Stars of Power

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Mark Nils Münzer

Distinguished Engineer Innovation & Emerging Technologies Automotive High Power

Infineon Technologies AG

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Zero Emission Becomes Real in Next-Generation Mobility

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CS Chua

President & Managing Director

Infineon Technologies AG

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Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics

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Dr. Gunar Lorenz

Sr Director Technical Marketing and Application Engineering for Consumer Sensors

Infineon Technologies AG

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Mass Manufacturing 8-inch GaN-on-Si Power Devices: the Next Generation of Power Switching Technology

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Denis Marcon

General Manager

Innoscience

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Innoscience’s GaN Power Devices: Reliable, Price Competitive and Mass Manufactured

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Denis Marcon

General Manager

Innoscience

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Innovative laser assisted bonding processes for next generation advanced packaging

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Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Advanced Packaging Ecosystem

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Dr. Babak Sabi

SVP & GM Assembly and Test Technology Development

Intel Corporation

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Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

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Teng Chow Ooi

Sr Director Program Office

Intel Corporation

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Doubling Charge Speed And Cycle Life Of The Most Common Batteries With A Revolutionary Charging Algorithm, Enabled By Semiconductors Technologies

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Sunil Banwari

COO

iontra

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ISES China 2023 Post Show Report

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ISES EU Power 2023_Event Agenda

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ISES Middle East 2023 Agenda

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ISES POWER EU 2023-Post Show Report

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ISES SEA 2023 Agenda

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ISES SEA 2023 Post Show Report

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ISES Taiwan 2023 – Agenda

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