Filter by all ISES Docs categories below or browse by year above

Select a 2024 summit below to view its ISES Docs

Select a 2023 summit below to view its ISES Docs

Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

Dr. Ming-Der Shieh photo

Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

  • Members Only
Join Membership

Heterogeneous Integration Enabled by Advanced Chiplet Packaging

Dr. Yang Cheng photo

Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

  • Members Only
Join Membership

Semiconductor Innovations Across a More Diversified End Market

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

  • Members Only
Join Membership

Optimizing Interconnect Density with New Packaging Technologies

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

  • Members Only
Join Membership

Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

  • Members Only
Join Membership

Process Control Trends for WBG Power Devices

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

  • Members Only
Join Membership

Advancing the Semiconductor Industry, TOGETHER

Andrew Goh photo

Andrew Goh

CVP & GM, Advanced Packaging Customer Operations

Lam Research Corporation

  • Members Only
Join Membership

Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging

Herbert Oetzlinger photo

Herbert Oetzlinger

VP Business Development

Lam Research Corporation

  • Members Only
Join Membership

A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology

Rozalia Beica photo

Rozalia Beica

Chief Commercial Officer

LQDX

  • Members Only
Join Membership

MEMS Global Landscape Overview and Challenges

Dr. Douglas Sparks photo

Dr. Douglas Sparks

President

M2N Technologies LLC

  • Members Only
Join Membership

How do MEMS start-ups play in the big pond of AR/VR world?

Matan Naftali photo

Matan Naftali

CEO

Maradin

  • Members Only
Join Membership

The New Packaging Math: 2x + 4y = 1

Wolfgang Sauter photo

Wolfgang Sauter

Customer Solutions Architect, Packaging

Marvell Technology

  • Members Only
Join Membership

Why Patents Matter

Steven Rizzi photo

Steven Rizzi

Principal

McKool Smith

  • Members Only
Join Membership

ICT Investments Opportunities in Oman

Fahad Sultan Al Abri photo

Fahad Sultan Al Abri

Director General of ICT Stimulations & Future Skills

Ministry of Transport, Communications and Information Technology (MTCIT)

  • Members Only
Join Membership

Welcome Speech

Dr. Ali Amur Ali Al Shidhani photo

Dr. Ali Amur Ali Al Shidhani

Undersecretary of Communications and Information Technology

Ministry of Transport, Communications and Information Technology (MTCIT)

  • Members Only
Join Membership

AI Computing in Large-Scale Era – The Golden Age of AI and IC

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

  • Members Only
Join Membership

About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

Thomas Russell photo

Thomas Russell

CEO and Co-Founder

Mesoline

  • Members Only
Join Membership

How The Semiconductor Industry Is Poised to Enable The Metaverse

Dr. Ofer Shacham photo

Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

  • Members Only
Join Membership

Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

Hisashi Kanazashi photo

Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

  • Members Only
Join Membership

Future Opportunities: Semiconductors Packaging

Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

  • Members Only
Join Membership

Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era

Sriram Srinivasan photo

Sriram Srinivasan

Partner Silicon Packaging Technology

Microsoft

  • Members Only
Join Membership

MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

  • Members Only
Join Membership

Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

  • Members Only
Join Membership

Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

  • Members Only
Join Membership

Electroless Metallization as Alternative Final Finish for Power Semiconductor Devices

Dr. Stefan Pieper photo

Dr. Stefan Pieper

Global Application Manager

Atotech

  • Members Only
Join Membership

Invest in Oman

Mohammed bin Ali bin Mohammed Al Lawati photo

Mohammed bin Ali bin Mohammed Al Lawati

Director of Investment Promotion Department by Delegation

Ministry of Commerce, Industry & Investment Promotions (MOCIIP)

  • Members Only
Join Membership

Fan-out Wafer Level MEMS Packaging for Automotive Applications

Senni Laaksonen photo

Senni Laaksonen

VP Research and Development

Murata

  • Members Only
Join Membership

MWS EU 2023 Agenda

No linked agenda item found.

  • Members Only
Join Membership

MWS EU 2023 Post Show Report

No linked agenda item found.

  • Members Only
Join Membership

Navigating the Dynamic Memory Market: Trends and Insights

Marco Mezger photo

Marco Mezger

COO & Executive Vice President

Neumonda

  • Members Only
Join Membership

GaN D-Mode vs. GaN E-Mode: A Clash of Technologies or The Perfect Co-Existence?

Bas Verheijen photo

Bas Verheijen

Senior Director GaN Technology and Operations

Nexperia

  • Members Only
Join Membership

Advanced Silicon Wafers for Optimized MEMS and RF Device Performance

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

  • Members Only
Join Membership

Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

  • Members Only
Join Membership

Scenario of Semi Industry Recovery

Akira Minamikawa photo

Akira Minamikawa

Senior Analyst

OMDIA

  • Members Only
Join Membership

Transforming the Sensor Market through a New Topology for MEMS

Eric Aguilar photo

Eric Aguilar

CEO

Omnitron Sensors

  • Members Only
Join Membership

How Silicon Carbide is Shifting the Future of EV – The Promise and Challenges

Dr. Tong Wu photo

Dr. Tong Wu

Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications

onsemi

  • Members Only
Join Membership

End of content

End of content