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AICS Solutions to High Value Problems

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Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities

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Dr. Mike Rosa

CMO & SVP Strategy

Onto Innovation

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Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond

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Keith Best

Director, Product Marketing, Lithography

Onto Innovation

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Process Control Challenges in Packaging for High Performance Computing Applications

Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Meeting Challenges in Power Device Fabrication with Advanced Metrology and Inspection

Dr. Vamsi Velidandla photo

Dr. Vamsi Velidandla

Senior Director, Product Management

Onto Innovation

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The Special Economic Zones, Free Zones and Industrial Zones in Oman

Thuraiya Al Zarafy photo

Thuraiya Al Zarafy

Investment Promotion & Business Development – Acting Manager

OPAZ

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How Optotune’s Products for Dynamic Light Control Benefit AR/VR Applications

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Dr. David Leuenberger

Head of Product Management

Optotune

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SiC / IGBT Power Module Assembly & Test Equipment Solutions

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Michael Koelbl

General Manager Pentamaster Automation Germany GmbH

Pentamaster

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US Based Equipment Manufacturer For Compounds Semiconductor Applications

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Yannick Pilloux

VP EMEA

Plasma-Therm

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Using MEMS and optics to create a unique solution for present and future applications

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Jon Edwards

VP Business Development

PoLight ASA

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Empowering Power Electronics Packaging Through Photonic Debonding

Vikram Turkani photo

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes

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Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

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Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas

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Package Design and Reliability Need in Server Systems

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Viresh Patel

VP Packaging Technology

Renesas

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Advanced Packaging/Substrate Materials and Open innovation Platform

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Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Advanced Packaging Materials and Evaluation Platform at Resonac

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Advanced Packaging Materials and Evaluation Platform at Resonac

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Going Vertical With MEMS: Unfolding System-Level Development Of Scanning Micromirror Technologies

Dr. Mohssen Moridi photo

Dr. Mohssen Moridi

Head of Research Division Microsystems

Silicon Austria Labs (SAL)

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Leading a World Class Research Institute

Dr. Mohssen Moridi photo

Dr. Mohssen Moridi

Head of Research Division Microsystems

Silicon Austria Labs (SAL)

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Heterogeneous Integration Platform for Next Generation Computing

Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung Electronics

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Wet Process and TBDB for Heterogeneous Integration

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Eric Lee

President of Sales Group

Scientech

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Future of SiC Power Modules in Automotive and Industrial Applications

Claus A Petersen photo

Claus A Petersen

President

Semikron Danfoss

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The Camera Module Industry and the Opportunity for MEMS and Micro-Manufacturing

Dr. Siavash Pourkamali photo

Dr. Siavash Pourkamali

Founder & CEO

Silicon Dynamix

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More than Moore Emerging Technologies for the Sensing Needs in EV

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Dr. Eloi Marigo Ferrer

Member of Technical Staff

SilTerra Malaysia Sdn. Bhd

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Semiconductors: Powering the Future and Driving the Global Economy

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Robert Quinn

Founder

SIMEU

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Challenges and Opportunities of the Semiconductors Industry in the MENA Region: An Egyptian Perspective

Dr. Hisham Haddara photo

Dr. Hisham Haddara

Chairman and Founder

SiWare Systems

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Innovative Traction Drives with SiC Semiconductors

Dr. Ladislav Sobotka photo

Dr. Ladislav Sobotka

Engineering and R&D Director

Skoda Electric

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

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Luba Tang

CEO

Skymizer Taiwan, Inc.

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Revitalizing Domestic Semiconductor Manufacturing: Challenges, Opportunities and Emerging Applications

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Thomas Sonderman

President & CEO

SkyWater Technology

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Business Benefits Of SmartSiC™: Unrivaled Technology For Sic In Automotive

Ph.D. Emmanuel Sabonnadière photo

Ph.D. Emmanuel Sabonnadière

VP Division Automotive & Industrial

Soitec

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Sound Generation by Active Modulation of Ultrasound

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Moti Margalit

CEO

SonicEdge

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MEMS Test Equipment Standardization: New Opportunities for OSATs and IDMs

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Marco Pratillo

Sales Manager Semi & MEMS Test Equipment BU

SPEA

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Addressing Testing Challenges for Power Modules and Three-Level Inverters

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Elia Petrogalli

Sales Manager Semi & MEMS Business Unit

SPEA

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Are New CS Markets Pushing Reliability Culture Shift?

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Roland Shaw

President of Accel-RF

STAr Technologies

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Intrinsic Reliability and Product Qualification Testing in GaN Power Semiconductors Do One the Other or Both?

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Roland Shaw

President of Accel-RF

STAr Technologies

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StethX Acoustic Wearable Patch for Monitoring and Diagnosis of Cardio-Pulmonary Conditions

Farrokh Ayazi photo

Farrokh Ayazi

Founder & CEO

StethX Microsystems

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