Future of SiC Power Modules in Automotive and Industrial Applications

ISES Docs:

The power electronics world is developing from utilizing Si devices towards SiC devices. Power density is one of the key factors in power electronics and with the right packaging technologies, great advantages can be obtained benefitting the system level significantly. Claus Petersen will touch on the importance of SiC, and the growing adaptation of SiC in Automotive applications as well as in industrial and renewable applications. In addition he will focus on packaging technologies to leverage SiC devices to its maximum potential.

Claus A Petersen photo

Claus A Petersen


Semikron Danfoss

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