Test Challenges in the AI & Chiplet era

ISES Docs:

This presentation will highlight challenges and current thought process for all facets such as DFT, Test, Qual and HVM during the product definition phase for successful silicon bring up and release to high volume production of High performance, Hyper scalar AI enhanced chips.

Srinivas Chinamilli photo

Srini Chinamalli

Co Founder & CEO


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