Dr. Abderrazzaq Ifis

Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges

In the semiconductor value chain, ASEAN countries have always played the role of OEM production hubs focusing on cost and mature technologies. Shifting from this role to a technology powerhouse involves a huge leap that requires the creation of a vibrant R&D environment (such as those found in Japan, Taiwan, South Korea and China who have recently achieved). This kind of R&D environment typically involves high capital expenditure, intense technology knowledge and a pool of highly educated talents that usually define the completeness of the whole supply-chain (for instance and it does not only apply for IC Design). On this note, ASEAN countries shall then concentrate their limited resources in covering this all-round industrial chain integrity (from infrastructure to talents). Our suggestion is therefore to focus on not only clustering regional readiness (for instance the infrastructure and the talents) but also on chocking points of the semiconductor value chain.

We, AT&S, believe that ICSubstrates is one of these few vehicles that would create a far reaching impact in Malaysia. As ICSubstrates is an essential element of Advance Packaging (reference More than Moore front-end Vs. Back-end nodes developments). With the technology of AT&S’s high end IC Substrates, it will bridge gap of the semiconductor value chain and to shift Malaysia from OEM producer to a powerhouse of R&D with a focus on high end IC substrate.

In our presentation we will show how by bringing into Malaysia AT&S proprietary technology of high end IC Substrates, we will develop and create high-tech knowledge that can be benefitical for all the surrounding countries, besides developing a more complete ecosystem for Advance packaging in Malaysia. This is what we trust AT&S would bring to Malaysia to enhance its position as a prominent player in semiconductor in ASEAN.