ISES SEA 2023 – Speaker
Jerome is having 25 years of experience in Package development and engineering.
His career started in Europe with the introduction of BGA , System in Package, embedding and optical camera sensors. Soon after Jerome moved to Singapore to develop southeast Asia packaging center of excellence focusing on next generation wafer level packaging introduction such as E-WLB (fan out).
Jerome transitioned in 2014 to onsemi and power electronics. Jerome’s team are focusing on the development and release to production of differentiated automotive package portfolio and solutions for wide band gap.
Intelligent Power and Sensing Packaging Solutions for a Sustainable Future
Vehicle electrification, autonomous driving, renewable energy and big data are enabling unprecedent changes in human life, and are pushing the technology to new limits. Those major evolutions require power electronics and sensing solutions, driven by optimum technology and packaging solutions to deliver maximum product efficiency.
This talk will review recent progress in front end technology , packaging (discrete, power modules) and highlight the importance of system integration.
It will illustrate the challenges of simultaneously meeting a wide range of power density, product scalability , cost and reliability requirements, and are made possible by the ongoing progress in semiconductor research, engineering and manufacturing.
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.