Speaker TBC

Position TBC
Company TBC

CVP of Assembly and Test, NAND Operations
Micron Technology, Inc.

Senior Director, Deputy Head of TSMC Advanced Packaging Technology and Service
TSMC

Sr. Vice President Global R&D Strategy
Amkor Technology, Inc.

Position TBC
AT&S

Position TBC
Bosch Sensortec

Position TBC
Company TBC

Position TBC
Company TBC

Position TBC
Company TBC

Position TBC
Company TBC

CEO
Globetronics

Position TBC
Hitachi

Position TBC
imec

Deputy Vice President
Inari

Position TBC
Infineon

Sr Director Program Office
Intel

Special Investment Advisor to the Chief Minister of Penang
InvestPenang

Position TBC
InvestPenang

TBC
Lam Research

Position TBC
MIDA

Head of Semiconductor
MIDA

Senior Director
MIMOS

Position TBC
Ministry of Higher Education

Position TBC
Ministry of Human Resources

Minister
MITI

President
MSIA

Position TBC
NXP

Position TBC
Omnitron Sensors

VP Package Development & Engineering
onsemi

CEO
PSDC

Position TBC
Rohm Semiconductor

Executive Director
Singapore Semiconductor Industry Association (SSIA)

Vice President, Power Discrete and Analog Products, Asia Pacific
STMicroelectronics

Position TBC
TalentCorp

Position TBC
TSMC

Position TBC
USM

Position TBC
Volvo

Senior Director, Flash Backend Engineering
Western Digital

Director of Product Line
Wolfspeed

Position TBC
Workforce solutions provider

Position TBC
Xiamen Skysemi

Position TBC
Yole

Sr. Market and Technology Analyst
Yole Group