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Welcome Speech

Salah Nasri photo

Salah Nasri

Senior Advisor to President

ISES

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Chiplets and Advanced Heterogeneous Integration

Dr. Terry Wu photo

Dr. Terry Wu

Director

Samsung Electronics

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Chiplets and System Integration – Key Concepts and Implementation

Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

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Heterogeneous Integration Enabled by Advanced Chiplet Packaging

Dr. Yang Cheng photo

Dr. Yang Cheng

Senior Director Design Service BU

JCET Group Co., Ltd.

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Interconnection Define Computing: Key Technology for Next Generation Computing Paradigm Evolution

MoChen Tian photo

MoChen Tian

Founder and CEO

Kiwimoore

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The Opportunity & Challenge of OSAT for the Coming Chiplet Integration Package

Yupeng Xu photo

Yupeng Xu

CTO

Forehope Electronic (Ningbo) Co., Ltd.

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Chiplet Process Integration Based on Glass Substrate and TGV Process

Dr. Wenbiao Ruan photo

Dr. Wenbiao Ruan

R&D Director

Xiamen Sky Semiconductor Technology Co., Ltd.

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Memory and Processors for Chiplet Designs

Simon Zhang photo

Simon Zhang

VP

Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.

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Advanced Packaging Materials and Evaluation Platform at Resonac

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

Dr. David Haynes photo

Dr. David Haynes

VP Strategic Marketing

Lam Research Corporation

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Tailored Solutions for the Semiconductor Industry Powered by TRUMPF

Dariusz Czaja photo

Dariusz Czaja

Managing Director of TRUMPF Hüttinger Asia / General Manager of TRUMPF Hüttinger China

TRUMPF Huettinger Electronics (Taicang) Co., Ltd.

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Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging

Laurent Giai-Miniet photo

Laurent Giai-Miniet

CEO

ERS Electronic GmbH

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Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards

Prof. Qinfen Hao photo

Prof. Qinfen Hao

Professor

Institute of Computing Technology, Chinese Academy of Science

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Memory and Processors for Chiplet Designs

Simone Bertolazzi, PhD. photo

Simone Bertolazzi, PhD.

Principal Technology & Market Analyst

Yole Intelligence

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