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Chiplets and Advanced Heterogeneous Integration
Dr. Terry Wu
Director
Samsung Electronics
Chiplets and System Integration – Key Concepts and Implementation
Jianmin Li
Packaging R&D Director, Amkor Technology China, Inc.
Amkor Technology, Inc.
Heterogeneous Integration Enabled by Advanced Chiplet Packaging
Dr. Yang Cheng
Senior Director Design Service BU
JCET
Interconnection Define Computing: Key Technology for Next Generation Computing Paradigm Evolution
MoChen Tian
Founder and CEO
Kiwimoore
The Opportunity & Challenge of OSAT for the Coming Chiplet Integration Package
Yupeng Xu
CTO
Forehope Electronic (Ningbo) Co., Ltd.
Chiplet Process Integration Based on Glass Substrate and TGV Process
Dr. Wenbiao Ruan
R&D Director
Xiamen Sky Semiconductor Technology Co., Ltd.
Memory and Processors for Chiplet Designs
Simon Zhang
VP
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
Advanced Packaging Materials and Evaluation Platform at Resonac
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Resonac Corporation
Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications
Dr. David Haynes
VP Strategic Marketing
Lam Research Corporation
Tailored Solutions for the Semiconductor Industry Powered by TRUMPF
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
TRUMPF Huettinger
Pushing the Boundaries of Thermal Management to Address Challenges in Wafer Test and Advanced Packaging
Laurent Giai-Miniet
CEO
ERS electronic GmbH
Focusing on the Collaboration and Leverage between UCIe and China Chiplet Standards
Prof. Qinfen Hao
Professor
Institute of Computing Technology, Chinese Academy of Science
Memory and Processors for Chiplet Designs
Simone Bertolazzi, PhD.
Principal Technology & Market Analyst
Yole Intelligence
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