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Japan’s Policy Trends in Semiconductor and Digital Industry Strategy

Hisashi Kanazashi photo

Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

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Glass Core Substrate: Next Gen Advanced Packaging Technology

Dr. Hamid Azimi photo

Dr. Hamid Azimi

Corporate VP, Director of Substrate Packaging TD

Intel Corporation

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Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era

Dr. Yasumitsu Orii photo

Dr. Yasumitsu Orii

Senior Managing Executive Officer, 3D Assembly Division

Rapidus

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3DFabric Advanced Packaging Technology Innovations for AI/HPC

Kathy Yan

Director SPIP

TSMC

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Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology

Deepak Kulkarni photo

Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

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Key Challenges in Enabling AI and Specialty Segments via Metrology, Inspection and Lithography Technologies

Toshihito Tsuga photo

Toshihito Tsuga

Regional Account Business Unit

Onto Innovation

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Enabling the AI Era

Choon Khoon Lim photo

Choon Khoon Lim

Senior Vice President; Co-CEO, Semiconductor Solutions Segment

ASMPT Limited

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The development of 3D stacking wafer-on-wafer(WoW) technology can provide a large number of connections between the SoC and memory chip, enable solutions for the memory bandwidth and power consumption issues

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Joe Wu

CEO

JSMC Holdings, Inc.

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NPU as the core of AI application: Market & Trends

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Axel Bialke

SVP Asia

aiMotive

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New Level Innovation of Advanced Heterogeneous Integration in AI Era

Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

Corporate VP / PKG Group, Product Technology, S.LSI

Samsung Electronics

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PANEL SESSION: Bridging the Gap Between R&D and Industry to Enhance Workforce Development

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Ken Shibita

President Japan

ISES

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Scenario of Semi Industry Recovery

Akira Minamikawa photo

Akira Minamikawa

Senior Analyst

OMDIA

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PANEL SESSION: Innovations and Challenges in Advanced Semiconductor Materials: Perspectives from Entegris, Soitec, and Resonac

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Kamel Ait Mahiout

President

ISES

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