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Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
Hisashi Kanazashi
Director IT Division
Ministry of Economy, Trade and Industry (METI)
Glass Core Substrate: Next Gen Advanced Packaging Technology
Hamid Azimi, Ph.D.
Chairman of the Board
International Semiconductor Industry Group (I.S.I.G.)
Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era
Dr. Yasumitsu Orii
Senior Managing Executive Officer, 3D Assembly Division
Rapidus
3DFabric Advanced Packaging Technology Innovations for AI/HPC
Kathy Yan, Ph.D.
Director of New Technology & System Integration, Advance Packaging and Test
TSMC
Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology
Deepak Kulkarni
Senior Fellow Advanced Packaging
AMD
Key Challenges in Enabling AI and Specialty Segments via Metrology, Inspection and Lithography Technologies
Toshihito Tsuga
Regional Account Business Unit
Onto Innovation
Enabling the AI Era
Choon Khoon Lim
SVP and CEO, Business Group Advanced Packaging
ASMPT Semiconductor Solutions
The development of 3D stacking wafer-on-wafer(WoW) technology can provide a large number of connections between the SoC and memory chip, enable solutions for the memory bandwidth and power consumption issues
Joe Wu
CEO
JSMC Holdings, Inc.
NPU as the core of AI application: Market & Trends
Axel Bialke
SVP Asia
aiMotive
New Level Innovation of Advanced Heterogeneous Integration in AI Era
Seung Wook Yoon, Ph.D, MBA
Package Group, Product Technology, CVP / Head of Group System LSI
Samsung Electronics
PANEL SESSION: Bridging the Gap Between R&D and Industry to Enhance Workforce Development
Ken Shibata
President Japan
PANEL SESSION: Innovations and Challenges in Advanced Semiconductor Materials: Perspectives from Entegris, Soitec, and Resonac
Kamel Ait Mahiout
President
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