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The Challenge of Speed – The Rapidus Model for a New Manufacturing Era

Kazunari Ishimaru photo

Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Rapidus

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Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry

Shinichi Yoshioka photo

Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas

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DRAM challenges and innovations for demanding AI workloads

Shigeru Shiratake photo

Shigeru Shiratake

Corporate Vice President DRAM Process Integration and Device Technology

Micron Technology, Inc.

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Semiconductor Innovation Success: Building on Global Collaboration Amongst Trusted Partners in Nanoelectronics R&D

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Lode Lauwers

Senior Vice President Business Development & Sales

imec

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Semiconductor Innovations Across a More Diversified End Market

Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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An OSAT Perspective of the Power Semiconductor Market

Katsumi Furuse photo

Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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Packaging Trends in the Power Semiconductor Market

Joseph Roybal photo

Joseph Roybal

Senior Vice President of Global Backend Operations

Wolfspeed

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