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Innovation to Enable More Compute From Each Transistor

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations


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Now is the Time to Re-imagine Memory Centric Computing

Steve Pawlowski photo

Steve Pawlowski

CVP Advanced Memory Systems

Micron Technology, Inc.

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Unleash Product Innovations with 3DFabric

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Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service


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Heterogeneous Integration Platform for Next Generation Computing

Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

Corporate VP / PKG Group, Product Technology, S.LSI

Samsung Electronics

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New Energy to Semiconductor – Heterogeneous Integration Packaging

Dr. C.P. Hung photo

Dr. C.P. Hung

Corporate VP RD


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A 360 View of Semiconductor Test from AI and Security Perspective

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions


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Hybrid Bonding: Innovation to Adoption

Abul Nuruzzaman photo

Abul Nuruzzaman

VP, Technology and IP Licensing


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GaN is Accelerating e-Mobility

Stephen Coates photo

Stephen Coates

GM & VP Global Operations

GaN Systems

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Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?

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Andy Chuang


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Digitalisation of Supply Chain – Using Latest Technology to Improve Logistics

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Aziza Dada

Sector VP


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Process Control Challenges in Packaging for High Performance Computing Applications

Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Challenges and Solution of FLI Technologies in various HI Packaging Architetures

Nelson Fan photo

Nelson Fan

VP, Head of KPU Advanced Packaging

ASMPT Limited

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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

Dr. Christian Ohde photo

Dr. Christian Ohde

Global Product Director SC/FEC


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3DIC W2W and D2W Hybrid Bonding

Thomas Schmidt photo

Thomas Schmidt

Product Manager, Bonder Division

SUSS MicroTec

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Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

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Elpin Goh

Senior Director, Strategic Marketing, CSBG

Lam Research Corporation

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

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Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging


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