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The Essential Evolution of Packaging in the Systems Foundry Era
Stuart Pann
SVP & GM
Intel Foundry
Advanced Packaging and Disaggregated Architectures for Automotive
Bassam Ziadeh
Global Technical Specialist – IC Packaging, Assembly & Test
General Motors
Advanced Packaging/Substrate Materials and Open innovation Platform
Hidenori Abe
CTO, Semiconductor Materials, Resonac Holdings Corporation
Resonac Corporation
Enabling the Next Generation of Scaling for Advanced Substrates
Niranjan Khasgiwale
VP Digital Lithography Group
Applied Materials
Solutions for Substrates Production
Laurent Nicolet
VP Business Electronics
SCHMID Group
Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle
Mario Morales
Group VP, Enabling Technologies and Semiconductors
IDC
Panel Discussion: The Future of Silicon Photonics
Josef Berger
Associate Vice President, Cloud Optics Marketing
Marvell Technology
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology
Rozalia Beica
Chief Commercial Officer
Panel Discussion: Supply Chain Continuity and Resiliency
Jeffrey Wincel
SVP & Chief Procurement Officer
NXP Semiconductors
Panel Discussion: Bridging Workforce, Research and Business to Meet the Future Needs of the U.S.
Najwa Khazal
General Manager STC Americas
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