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National Semiconductor Hub Saudi – Naveed Sherwani – Fireside Chat
How Semiconductors Drive Sustainable Innovation
Francesco Muggeri
VP Marketing & Applications, Power Discrete & Analog, China
STMicroelectronics
Harnessing the Benefit of Precious Metals Deposition While Managing Total Cost of Ownership
Richard Oliveri
VP, General Manager
Materion
The necessity to have the right logistics partner in South East Asia to support the Global Supply Chain
Brandon Kennedy
Global Managing Director, High-Tech & Industrials
Airspace
LOW COST, SCALABLE and FLEXIBLE line for different types of IC Packaging (LGA, BGA, QFN, SiP, AiP, DrMOS, Power Invertor)
Jimmy Chew
Chief Executive
PEP Innovation
Impact of Generative AI in Advanced Packaging
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yole Group
SoC Design with AI: Unlocking Innovation, Efficiency, Complexity Management, and Foundry Collaboration
Michael Woon Chin Liew
Senior Principal Engineer
StarFive Technology International Sdn. Bhd.
InvestPenang
Panel Discussion: “Building a Robust Manufacturing Ecosystem”
Noorazidi Che Azib
Deputy Vice President
Inari Technology Sdn. Bhd. (a wholly-owned subsidiary of Inari Amertron Berhad)
Digital: The New Key Strategy of Advanced Manufacturing
Yvonne Keil
Senior Director GF Operations India/Malaysia
GlobalFoundries
The Future of Advanced Semiconductor Manufacturing
Kok Tiong Ng
SVP and Managing Dir., Infineon Technologies Kulim Sdn Bhd
Infineon Technologies AG
Opening Remarks- YB Jagdeep Singh Deo A/L Karpal Singh – Deputy Chief Minister II of Penang
Opening Remarks- MIDA – Zalina Zainol, Deputy Chief Executive Officer (Investment Development)
Panel Discussion: “Workforce Development and Talent Retention in the Semiconductor Industry”
Dr. Hari Narayanan
CEO
PSDC (Penang Skills Development Centre)
Panel Discussion: “Investing for tomorrow: Funding the Next Wave of Semiconductor Growth”
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
IC Technology Platform for Efficient Customization of Automotive Chips
Ser Wah Oh
General Manager
Joinsilicon
Designing for Tomorrow : Evolving Challenges in Semiconductor Design
J-Wing Teh
Director of Silicon & Systems Design Engineering
AMD
I.S.I.G. Accelerator Program
Salah Nasri
CEO and Co-Founder
International Semiconductor Industry Group (I.S.I.G.)
AI in MEMS Manufacturing – A collaborational challenge for the entire value chain
Dr. Florian Schuster
Director of Product Management
Bosch
The Blueprint for Sustainable Fabs
Henri Berthe
Semiconductors Segment VP • Sales
Schneider Electric
GenAI in Semiconductor Manufacturing
Koen De Backer
CVP Smart Manufacturing & AI
Micron Technology, Inc.
Opening Speech
Opportunities in Commercial Vehicle Decarbonization 商用车辆的低碳机遇
Vishnu Kumaresan, Ph.D
Semiconductor Business Specialist & Segment Leader
Volvo Group
Part 3 Panel : Synergy Driving Innovation in electrification & Mobility 圆桌讨论：协同驱动电气化与移动性创
Salah Nasri
CEO & Co-Founder
I.S.E.S.
From Prototyping to Advanced Manufacturing of Sensors and Optical Components for Automotive Applications. 从原型设计到汽车应用中传感器和光学元件的高级制造。
Maksym Plakhotnyuk, Ph.D.
CEO & Founder
ATLANT 3D
An OSAT Perspective of the Power Semiconductor Market OSAT对电力半导体市场的视角
Troy Lin
Director, Product Marketing
Amkor Technology, Inc.
Electroless Metallization of power semiconductor devices – challenges and benefits 功率半导体器件的化学镀金属化—挑战与机遇
Dr. Stefan Pieper
Global Application Manager
mks | Atotech
Deep Silicon Etch – Enabling Key Solutions in Specialty Technologies 深度硅刻蚀 — 推动专业技术关键解决方案
Dr. David Haynes
VP Strategic Marketing
Lam Research Corporation
Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level 确保功率半导体的可靠性：在KGD（良品芯片）级别测试SiC半导体器件
Yuanli Sun
General Manager, SPEA China
SPEA
Mastering Plasma Technology Application – focus on local support for the semiconductor industry 掌握等离子体技术应用 – 专注于半导体行业的本地支持
Pawel Ozimek, Ph.D EE
CTO, TRUMPF Huettinger and Managing Director, TRUMPF Huettinger Poland
TRUMPF Huettinger
High Voltage SiC MOSFET for renewable energy application with simpler design and higher power density 高电压SiC MOSFET用于可再生能源应用，具有更简单的设计和更高的功率密度。
Kevin Shen
Chief Strategy & Business Operation Officer
WeEn Semiconductors
Embracing SiC in Electric Vehicles 在电动车中拥抱碳化硅
Tong Wu, Ph.D.
Leader of Auto Marketing and Technical Team, Principal Expert, SiC Applications
onsemi
Bosch SiC Enable the Future Electric Mobility 博世SiC赋能未来电动出行
Dr. Richard Feng
Director of power semiconductor and module R&D center
Robert Bosch GmbH
Powering the Future: Innovations in Power Semiconductors for Vehicle Electrification and Beyond 驱动未来：汽车电气化与功率半导体创新发展报告
Yik Yee Tan, PhD
Senior Technology & Market Analyst, Semiconductor Packaging
Yole Group
Technology Innovation of ROHM’s Power Devices ROHM电源设备的技术创新
Jun Li
General Manager (FAE Head Quarter), Shanghai
ROHM Semiconductor
The Layout of Electric Drive and High Voltage System in NIO 蔚来在电驱及高压系统的布局
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
NIO
Infineon Enables Automotive Decarbonization and Digitization Development Infineon 助力汽车低碳化与数字化发展
Gary Zhong
Senior Director and Head of Vehicle Motion Segment
Infineon Technologies AG
Semiconductor Strategies for the Transition to Sustainable Energy and Mobility 向可持续能源和移动转型的半导体战略
Dino Costanzo
Application Director and head of Motor Control Competence Center in AP.
STMicroelectronics
Global Automotive Outlook 全球汽车发展展望
Janet Tang
Partner & Managing Director
AlixPartners
CRRC Automotive Power Semiconductor Technology Innovation and Industrialization 中车汽车功率半导体技术创新与产业化
Ding Rongjun
Academician of Chinese Academy of Engineering, Chief Engineer CRRC 丁荣军 院士 / 中车总工程师
CRRC
Huishan District People’s Government Promotion Speech 惠山区集成电路产业推荐
Research and Innovation in Full-Stack Electric Drive System Power Solutions 全栈式电驱动系统动力解决方案研究与创新
Haisheng Yu
CTO
InfiMotion ( Power R&D Center for Geely)
Technical Trends of Automotive SiC Modules 车载SiC模块的技术新趋势
Jeff Ding
Co-founder & CEO
Wuxi Leapers Semiconductor Co., Ltd.
Unfolding the Future: Driving Research and Innovation for Automotive Applications 未来展望：推动汽车应用的研究与创新
Angeline Tee
Senior Management | Strategic Planning & Partnership Management
Silicon Austria Labs (SAL)
IC Technology Platform for Efficient Customization of Automotive Chips IC技术平台助力汽车芯片高效定制
Jason Wang
Founder
Joinsilicon
Bringing Semiconductor Value Chain to the Kingdom of Saudi Arabia – Now and Future 将半导体价值链引入沙特阿拉伯王国——现在与未来
Sunil Banwari
CEO Semiconductor
Ajlan & Bros Megaprojects
Wide-Bandgap Power Semiconductors Provide New Power for Automotive Electrification 宽禁带功率半导体为汽车电气化提供新动力
Tim Yeh, Ph.D.
Technical Director
Sanan Semiconductor
Introducing the IGTO(t) a Novel Silicon High-Voltage Power Switch
Ben Quinones
CEO & Co-founder
Pakal Technologies, Inc
Ensuring Power Semiconductor Reliability: Testing SiC Semiconductor Devices at KGD Level
Higor Batagin
Sales Manager – Semi & MEMS Business Unit
SPEA
Power semiconductor Reliability Test & Handling Equipment Solutions
Alex Liew
SVP, Sales & Operations
Pentamaster
Where is wafer processing going and enhancing manufacturing|Current state of the supply chain and building resilience|Considerations in inspection and metrology
Mike Rosa, Ph.D.
CMO & SVP Strategy
Onto Innovation
WBG Industry at a Crossroads: Navigating the Shifting Market Landscape
Poshun Chiu
Senior Technology & Market Analyst, Semiconductor Substrates & Materials
Yole Group
Department of Energy Activities & Perspectives on Powering the Transformation of Our Energy Future
Paul Syer
Technology Manager
U.S. Department of Energy Advanced Materials & Manufacturing Technologies Office
An OSAT Perspective of the Power Semiconductor Market
Michael Johnson
Sr Director, Power Discrete & Modules
Amkor Technology, Inc.
WBG Technologies and Foundry Services for “Industrial and Renewable Energy” applications.
François Hebert
Vice President – Power Product Management, Power Product Line
GlobalFoundries
Future Direction Beyond Automotive and Overcoming Gaps for Future Workforce
Victor Veliadis, Ph.D.
Executive Director & CTO
PowerAmerica
Silicon fab transformed through CHIPS: A new US 200mm foundry launches to deliver power innovation and high-volume manufacturing
Surya Iyer, Ph.D.
President & COO
Polar Semiconductor
Metrology and Inspection Solutions for SiC and GaN Power Devices
Jiangtao Hu
Sr. Director Product Marketing
Onto Innovation
GaN – Accelerating growth across the power spectrum with an ecosystem strategy
Primit Parikh, Ph.D.
VP & GM, GAN Business Division
Renesas Electronics
The Power to Make It Real: The SiC Power Semiconductor Revolution
John Edmond
Co-founder & Research Fellow
Wolfspeed
From Concept to Application: INL’s Breakthroughs in MEMS Technology
Filipe Alves
Staff Researcher
INL (International Iberian Nanotechnology Laboratory)
European Chips Act (EUCA) and the FMD Pilot line “Advanced Heterogenous Systems Integrations (AHSI)”
Dr. Michael Eritt
Head of Department Engineering
Fraunhofer Institute for Photonic Microsystems
Exploring the latest and future MEMS trends
Pierre-Marie Visse
Senior Technology & Market Analyst, MEMS & Sensing
Yole Group
CSEM, a MEMS and PICs powerhouse in the Swiss industrial ecosystem
Dr. Andreas Charles Voelker
Business Development, Micro- & Nanotechnologies
CSEM
Opening Gas Sensing Possibilities with Silicon Photonics-Based Sensors
Dr. Tristan Rousselle
Founder & CEO
Aryballe
Smart tires : powerful sensors for modern mobility
Corrado Rocca
R&D Head, Cyber Unit
Pirelli
SITRI – MEMS Sensor and SiPh R&D Pilot Line Platform
Bo Cui
Senior Director of Research
Shanghai Industrial Technology Research Institute (SITRI)
Vibration sensors with AI for in industry applications
Dr. Jacob Hsu
CTO of Smart Sensing & Systems Technology Center
Industrial Technology Research Institute (ITRI)
Piezoelectric MEMS Acoustic Transducers at Silicon Austria Labs: technology platforms and emerging applications
Dr. Annalisa De Pastina
Senior Scientist in Piezoelectric Microsystem Technologies
Silicon Austria Labs (SAL)
Disruptive MEMS Power Technology – The Ideal Switch for Power applications
Yalcin Bulut
COO
Menlo Microsystems Inc.
MEMS inertial sensors for navigation applications
Stefan Rombach
Head of MEMS
Northrop Grumman LITEF GmbH
Enhancing Europe’s Leadership in MEMS & Sensors: Seizing Opportunities with the EU Chips Act
Pierre Chastanet
Head of Unit of “Microelectronics and Photonics Industry” Unit, DG CNECT
EU Commission
Illuminating and complementing: Light-Based Sensing
Dr. Roland Helm
Senior Vice President, Head of Integrated Optical Sensing
ams OSRAM
Transforming Industrial Manufacturing: Harnessing the Potential of Ultra High Viscosity Jetting for Functional Printing
Ramon Borrell
CTO
Quantica
New Foundry MEMS Ecosystem Accelerator
Doug Sparks
Vice President Business Development
InchFab
Ensuring Performance and Accuracy: Production Testing Strategies for Next-Generation Environmental Sensors
Marco Pratillo
Sales Manager Semi & MEMS Test Equipment BU
SPEA
Advance CMOS technology to unleash the full power of MEMS sensor
Ruby Yan
Business Unit Director – Display, Sensor, Security
GlobalFoundries
How will Generative AI shape the future of MEMS Microphones?
Aldo Bruno
Technical Lead MEMS Sensor System Competence Team
Infineon Technologies AG
The Sensorization of the Modern Vehicle
Alastair Attard
Director of Technical Program Management & Business Development
UTAC
Industrialization challenges for advanced packaging in foundry environment
Volker Herbig
VP BU Microsystems
X-FAB
Transforming Automotive Interfaces with UltraSense Systems’ Cutting-Edge Monolithic Silicon/PMUT Technology
Mo Maghsoudnia
Founder & CEO
UltraSense Systems
Advances in MEMS Sensors & Technologies
Dr. Ando Feyh
MEMS Strategy Management, New Business and M&A
Bosch
Advance Packaging for Automotive MEMS and Sensors
Stefan Martens
Sr Director, MEMS and Sensor BU
Amkor Technology, Inc.
It is not only about AI in MEMS and sensors
Tarik Souibes
Product Marketing Director
STMicroelectronics
Is Europe ready to lead the GaN revolution?
Marnix Tack, Ph.D.
CTO & VP Business Development
GaN-on-Si technology for efficient RF front-ends
Bertrand Parvais
Principal Member of Technical Staff
imec
Isolation – APackage requirement
Ralf Keggenhoff
Global Director Application Engineering Semiconductor Business Unit
Littelfuse
Introducing Silicon Interposers for Power Applications
Ahmed Ammar
Co-Founder, Head of Product
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