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Welcome Speech

Salah Nasri photo

Salah Nasri

Senior Advisor to President

ISES

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Panel Session: Standardization for Chiplet and Advanced Packaging

Dr. Kuan-Neng Chen photo

Dr. Kuan-Neng Chen

Chair Professor

NYCU

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Powering the AI Revolution through Innovations in High Bandwidth Memory

Bret Street

Bret Street

Senior Director of Advanced Packaging

Micron Technology, Inc.

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ISES Welcome Address

Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

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State-of-the art solutions for AI Chip manufacturing

Robert Wanninger photo

Robert Wanninger

Senior Vice President Business Unit Advanced Backend Solutions

SUSS MicroTec

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Generative AI Driven Advanced Packaging and Materials Innovation

Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations

AMD

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The Impact of PulseForge’s Photonic Debonding on Temporary Bonding and Debonding Processes

Vikram Turkani photo

Vikram Turkani

Director, Technology Partnerships and Strategic Business Development

PulseForge

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Generative AI and Chiplet: Impact on semiconductor industry and position of Taiwan

Jéröme Azémar photo

Jérôme Azemar

Custom Project Business Development Director

Yole Group

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Micro LED Technology and Platform Trend

Sam Chen photo

Sam Chen

Senior Director

Unikorn Semiconductor Corporation

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Intelligent Computing Everywhere

ST Liew photo

ST Liew

President, Taiwan & SEA Australia, New Zealand Vice President

Qualcomm Technologies Inc.

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HBM (High Bandwidth Memory) and Advanced Packaging Technology for AI Era

Kangwook Lee photo

Dr. Kangwook Lee

SVP and Head of PKG Development

SK Hynix

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Wet Process and TBDB for Heterogeneous Integration

Eric Lee photo

Eric Lee

President of Sales Group

Scientech

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Chiplet Ecosystem Acceleration

KC Hsu photo

K.C. Hsu

VP, Research & Development / Integrated Interconnect & Packaging

TSMC

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AI Computing on Edge Devices

Dr. Bor-Sung Liang photo

Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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Innovative laser assisted bonding processes for next generation advanced packaging

Matthias Fettke photo

Matthias Fettke

VP Advanced Packaging Equipment

PacTech

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Enabling Metrology, Inspection and Lithography Technologies for AI and HPC Packaging

Dr. Monita Pau photo

Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Heterogeneous Integration for Photonic Light Engines

Dr. Radha Nagarajan photo

Dr. Radha Nagarajan

SVP & CTO

Marvell Technology

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Advanced Packaging Technologies for Heterogenous Integration: Glass Core Package Substrate

Rahul Manepalli, Ph.D. photo

Rahul Manepalli, Ph.D.

Intel Fellow; Director Substrate TD Module Engineering

Intel Corporation

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Optical I/O Technology for the Future of AI

Mark Wade photo

Mark Wade

CEO

Ayar Labs

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Assembly Technologies for the Front End

Chris Scanlan photo

Chris Scanlan

SVP Technology

Besi

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Co-Packaged Optics and Solutions for High Volume manufacturing

Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Limited

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REALITY Twin vs. Digital Twin: Revolutionizing Industrial Remote Management

CJ Hsieh photo

CJ Hsieh

COO

ASPEED

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RISC-V Accelerating ML Innovation and Beyond

Samuel Chiang photo

Samuel Chiang

Deputy Technical Director

Andes Technology

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Disruptions in Semiconductor Supply Chain

Michael Mo photo

Michael Mo

Partner and Managing Director

AlixPartners

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Unlocking Values: The Power of AI/ML in Semiconductor Test

Michael Chang photo

Michael Chang

VP & GM, Advantest Cloud Solutions

Advantest

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Panel Discussion: Bridging Workforce, Research and Business to Meet the Future Needs of the U.S.

Najwa Khazal photo

Najwa Khazal

General Manager STC Americas

Edwards

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Why Patents Matter

Steven Rizzi photo

Steven Rizzi

Principal

McKool Smith

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Panel Discussion: Supply Chain Continuity and Resiliency

Jeffrey Wincel photo

Jeffrey Wincel

SVP & Chief Procurement Officer

NXP Semiconductors

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A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology

Rozalia Beica photo

Rozalia Beica

Chief Commercial Officer

LQDX

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Panel Discussion: The Future of Silicon Photonics

Josef Berger photo

Josef Berger

Associate Vice President, Cloud Optics Marketing

Marvell Technology

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Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle

Mario Morales photo

Mario Morales

Group VP, Enabling Technologies and Semiconductors

IDC

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Solutions for Substrates Production

Laurent Nicolet photo

Laurent Nicolet

VP Business Electronics

SCHMID

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Enabling the Next Generation of Scaling for Advanced Substrates

Naranjan Khasgiwale photo

Niranjan Khasgiwale

VP Digital Lithography Group

Applied Materials

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Advanced Packaging/Substrate Materials and Open innovation Platform

Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

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Advanced Packaging and Disaggregated Architectures for Automotive

Bassam Ziadeh photo

Bassam Ziadeh

Global Technical Specialist – IC Packaging, Assembly & Test

General Motors

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The Essential Evolution of Packaging in the Systems Foundry Era

Stuart Pann photo

Stuart Pann

SVP & GM

Intel IFS

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