Welcome Speech

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Salah Nasri

President

ISES

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Intelligent Power and Sensing Packaging Solutions for a Sustainable Future

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Jerome Teysseyre

VP Package Development & Engineering

onsemi

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Wolfspeed’s SiC Optimized Power Module Approach

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Sascha Dern

Director of Product Line

Wolfspeed

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Innovative Power Solutions in Industrial Applications driving towards Carbon Neutrality and Greener Future

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Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China

STMicroelectronics

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Piezoelectric MEMS Platform for Sensing and RF Applications

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Dr. Yul Koh

Senior Scientist

A*Star IME

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More than Moore Emerging Technologies for the Sensing Needs in EV

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Dr. Eloi Marigo Ferrer

Member of Technical Staff

SilTerra Malaysia Sdn. Bhd

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Global Vehicle Electrification Trends and BEV Opportunities in the Developing World

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Dr. Yik Yee Tan

Sr. Market and Technology Analyst

Yole Intelligence

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Zero Emission Becomes Real in Next-Generation Mobility

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CS Chua

President & Managing Director

Infineon Technologies AG

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Future Opportunities: Semiconductors Packaging

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Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

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Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate

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Kamel Ait Mahiout

President

ISES

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Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

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Teng Chow Ooi

Sr Director Program Office

Intel

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Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth

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YT Chin

Senior Director, Flash Backend Engineering

Western Digital

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Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology

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Fouzun Naseer

Director R&D, Technology, Industry

CREST

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System-level Packaging: Challenges and Solutions

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Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

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MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

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Thiagesh K Lingam

Senior Director

MIMOS

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Opening Address

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YAB Chow Kon Yeow

Chief Minister of Penang

Penang State Government

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How Chinese local makers get ready to power the EV market?

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Dr. Hongchao Liu

SVP/Chief Scientist

Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)

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GaN HEMT for Electric Car Inverter: Breakthroughs and Challenges

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Jim Jian

VP Sales APAC and NA

VisIC Technologies

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