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Advanced Packaging and Disaggregated Architectures for Automotive

The recent growth in ADAS and Autonomous Driving has brought a new focus to automotive compute while simultaneously, the introduction of Software Defined Vehicles has seen a consolidation of automotive compute into a centralized architecture – a stark departure of previous distributed zonal architectures. These recent developments have brought great interest and focus into the deployment of advanced packaging and the adoption of “chiplets” through heterogenous architectures.

This talk will address the areas of focus for adopting advanced packaging in automotive use cases as well as put forward a pragmatic approach for introducing chiplets and disaggregated architectures for autonomous driving and ADAS features. Lastly, the talk will cover some critical areas of development and roadblocks for adoption into L4+ systems – such as interposer qualification, material qualifications, and an open chiplet ecosystem.

Bassam Ziadeh photo

Bassam Ziadeh

Global Technical Specialist – IC Packaging, Assembly & Test

General Motors