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Assembly Technologies for the Front End

The drive towards 3D chiplets to extend Moore’s law is changing the way we think about advanced packaging interconnect. Assembly processes like die attach that used to be performed only in back-end factories are now being inserted into front-end wafer fabrication process flows. This presentation explores the latest advancements in front-end assembly technologies, focusing on bringing hybrid bonding into production and improving its accuracy and speed. We will also delve into recent advancements in TCB for 3D chip-to-wafer connections. The discussion will compare and contrast the relative benefits of hybrid bonding and TCB for both logic and memory applications. The adoption of these technologies in high performance AI devices and other applications will be discussed.

Chris Scanlan photo

Chris Scanlan

SVP Technology