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Meeting Challenges in MEMS with Advanced Metrology and Inspection Capabilities

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Dr. Mike Rosa

CMO & SVP Strategy

Onto Innovation

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Fan-out Wafer Level MEMS Packaging for Automotive Applications

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Senni Laaksonen

VP Research and Development

Murata

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About Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

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Thomas Russell

CEO and Co-Founder

Mesoline

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MEMS Testing Panel

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George Harris

VP Global Test Services

Amkor Technology, Inc.

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Innovating For A Greener Future: The Role Of MEMS Microphones In Driving Sustainable And Energy Efficient Consumer Electronics

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Dr. Gunar Lorenz

Sr Director Technical Marketing and Application Engineering for Consumer Sensors

Infineon Technologies AG

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Improving the LLM experience with sensor provided context

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Dr. Michael Pate

Mobile Audio Systems, Algo, Architecture Lead

Google

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Let’s Mobilize Digital Innovation in Europe

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Samira Nik

Programme Manager – Quantum Technologies and Electronics

European Innovation Council and SMEs Agency (EC EISMEA)

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Crossbreeding of MEMS, CMOS, CSOI, Optics and Assembly

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Dr. Stefan Majoni

Director Foundry MEMS

Bosch

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EVATEC – Mastering Deposition Technologies from Core to Package

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Maurus Tschirky

Senior Strategic Marketing Manager

Evatec

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Atomic-Layer Advanced Manufacturing

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Maksym Plakhotnyuk, Ph.D.

Founder & CEO

ATLANT 3D

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Accelerating MEMS Product Validation and Commercialization with IME ScAlN MEMS Platform

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Angeline Tee

Deputy Director Business Development

A*Star IME

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New Challenges for MEMS and Sensor Packaging

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Adrian Arcedera

SVP Memory, MEMS and Sensor Business Unit

Amkor Technology, Inc.

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AMEC Company Update and Offshore Manufacturing Plan

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Pat Walsh

Managing Director NA/EU

AMEC

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Display Technology for Metaverse – A Foundry’s Perspective

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Steven Hsu

VP Technology Development

UMC

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3DIC W2W and D2W Hybrid Bonding

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Thomas Schmidt

Product Manager, Bonder Division

SUSS MicroTec

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Unleash Product Innovations with 3DFabric

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Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service

TSMC

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From Hyperscale Models to Heterogeneous SoCs: Industrializing Neural Network Deployment with ONNC

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Luba Tang

CEO

Skymizer Taiwan, Inc.

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Heterogeneous Integration Platform for Next Generation Computing

Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

Corporate VP / PKG Group, Product Technology, S.LSI

Samsung Electronics

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Inspiring a new reality with XR

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Patrick Chiang

Sr Director Technical Marketing

Qualcomm Technologies Inc.

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Process Control Challenges in Packaging for High Performance Computing Applications

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Dr. Monita Pau

Strategic Marketing Director for Advanced Packaging

Onto Innovation

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Opportunities and Challenges for MicroLED Display

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Dr. Charles Li

CEO & Co-Founder

PlayNitride Display Co., Ltd.

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Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?

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Andy Chuang

Consultant

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Navigating the Dynamic Memory Market: Trends and Insights

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Marco Mezger

COO & Executive Vice President

Neumonda

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Technology Pushes Limits – How New Plating Solutions Enable the Semiconductor Devices of Tomorrow

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Dr. Christian Ohde

Global Product Director SC/FEC

Atotech

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Now is the Time to Re-imagine Memory Centric Computing

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Steve Pawlowski

CVP Advanced Memory Systems

Micron Technology, Inc.

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AI Computing in Large-Scale Era – The Golden Age of AI and IC

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Bor-Sung Liang, Ph.D

Senior Director, Corporate Strategy & Strategic Technology

MediaTek

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Deep Reactive Ion Etch – Enabling Advanced Specialty Technologies and Packaging Applications

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Elpin Goh

Senior Director, Strategic Marketing, CSBG

Lam Research Corporation

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How The Semiconductor Industry Is Poised to Enable The Metaverse

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Dr. Ofer Shacham

VP, Head of Silicon, at Meta Reality Labs

Meta

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Opening Speech – Challenges & Opportunities of LLM and Generative AI: A Hardware Perspective

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Dr. Ming-Der Shieh

CTO of Electronic and Optoelectronic System Research Laborations (EOSL)

Industrial Technology Research Institute (ITRI)

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GaN is Accelerating e-Mobility

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Stephen Coates

GM & VP Global Operations

GaN Systems

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Future of Taiwanese Semiconductor Supply Chain: Collaborations with International Partners

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Ray Yang

Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)

Industrial Technology Research Institute (ITRI)

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Thinfilm Technology for Heat Dissipation Layers in HPC Applications

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Ralph Zoberbier

SVP & Head of Business Unit Advanced Packaging

Evatec

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Turning Metaverse to Photorealistic Digital Twins for Driving Smart Factory Innovations

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CJ Hsieh

COO

ASPEED

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Unleashing the Power of AI: Opportunities and Challenges Ahead

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Dr. Justin Chueh

Director Monolithic and Heterogeneous Integration Department

Etron Technology Inc.

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Challenges and Solution of FLI Technologies in various HI Packaging Architetures

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Nelson Fan

VP, Head of KPU Advanced Packaging

ASMPT Limited

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New Energy to Semiconductor – Heterogeneous Integration Packaging

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Dr. C.P. Hung

Corporate VP RD

ASE

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