HANGZHOU SILAN INTEGRATED CIRCUIT CO. LTD

Meet this member at:

China International Semiconductor Executive Summit

Attended by

  • General Manager

Company Profile

Since 1997

As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.

The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 210,000 pieces, ranking fifth in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. At the end of 2019, the construction of the main building for the first-stage project of the first production line for 12-inch chips was completed, and a production pilot was conducted for the compound semiconductor device production line.

Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.

Our product and R&D investment is mainly focused on the following three fields:

ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.

MEMS sensors & Digital audio SoC and speech recognition.

Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).

士兰微始于1997

杭州士兰微电子股份有限公司(600460)坐落于杭州高新技术产业开发区,是专业从事集成电路芯片设计以及半导体微电子相关产品生产的高新技术企业。公司成立于1997年9月,总部在中国杭州。2003年3月公司股票在上海证券交易所挂牌交易,是第一家在中国境内上市的集成电路芯片设计企业。得益于中国电子信息产业的飞速发展,士兰微电子已成为国内规模最大的集成电路芯片设计与制造一体(IDM)的企业之一,其技术水平、营业规模、盈利能力等各项指标在国内同行中均名列前茅。士兰微电子建在杭州钱塘新区的集成电路芯片生产线目前实际月产出达到21万片,在小于和等于6英寸的芯片制造产能中排在全球第五位。同时,公司8英寸生产线于2015年开工建设,2017年投产,成为国内第一家拥有8英寸生产线的IDM产品公司。2018年,公司12英寸特色工艺晶圆生产线及先进化合物半导体器件生产线已经在厦门开工建设。2019年年底,第一条12吋生产线一期工程已完成主体厂房工程建设,化合物半导体制造生产线项目开始试产。

公司的技术与产品涵盖了消费类产品的众多领域,在多个技术领域保持了国内领先的地位,如绿色电源芯片技术、MEMS传感器技术、LED照明和屏显技术、高压智能功率模块技术、第三代功率半导体器件技术、数字音视频技术等。同时利用公司在多个芯片设计领域的积累,为客户提供针对性的芯片产品系列和系统性的应用解决方案。

公司目前的产品和研发投入主要集中在以下三个领域:基于士兰芯片生产线高压、高功率、高频特殊工艺的集成电路、功率模块(IPM/PIM)、功率器件及(各类MCU/专用IC组成的)功率半导体方案。

MEMS传感器产品、数字音视频和智能语音产品。
光电产品及LED芯片制造和封装(含内外彩屏和LED照明)。

Meet our members at our events