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nepes offers Advanced Assembly & Test manufacturing services including wafer bumping, WLP and SiP, Fan-out for global fabless and integrated device manufacturer.
Our full turn-key services offer design, characterization, back-end processing, and electrical test.
nepes operates fabs in Korea, Philippines, and China. Nepes also has sales branch office in San Diego, USA and Shanghai, China.
1. Bumping : A packaging solution using conductive bump instead of the conventional metal line for connection.
2. WLP : An optimal packaging solution for processing bumping and RDL without cutting the wafer. The current product applications are power management IC, Codec, Touch screen controllers, DDI, System ICs in Mobile and Automotive.
3. Fan Out-WLP/PLP : A micro packaging solution to make smaller, high-function chips by redistributing I/O terminals outside the periphery of the chip.
4. SiP : Cost effective wafer level batch process for Heterogeneous Integration of ultra-thin profile.