Founded in July 2018, Xiamen Sky-semi commits to the development and industrialization of advanced packaging and system integration technology for high-speed and high-frequency communication applications. Through independent R&D and collaborative innovation, we provide customers with integrated solutions and services from collaborative product design, process research and development to mass production.
The main business of Xiamen Sky-semi includes Wafer Level 3D Package (WLP), Fan Out Package (FO), System in Package (SIP) and Module, IPD device manufacturing, High Density Glass Through Via (TGV) technology, manufacturing of high precision antenna ,etc. We have provided design, packaging and integration services for nearly 100 customers at home and abroad。Sky-semi has a core team with outstanding innovation ability that has broken through a series of core and key technologies and has full range of wafer level system packaging as well as precision manufacturing capabilities from 4 inch, 6 inch, 8 inch to 12 inch.
Sky-semi Semiconductor based on technological innovation embarking on seize the historical opportunity to achieve leapfrog development in the new era of global semiconductor industry competition pattern by adhere to customer-centered ，Innovative and progressing philosophy，5G application as a breakthrough.