Meet this member at:

MEMS World Summit China

Attended by

  • MEMS BU Leader
  • LGA MEMS BU Manger, R&D

Company Profile

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the largest package and test portfolios in the world. Founded in 1972, Carsem is among the most experienced companies in the industry and it is recognized as one of the largest in unit volume production. The company has over 9,000 employees and assembles in excess of 100 million units each week, more than 65 percent of this volume is fully electrically tested product. Carsem is a member of one of Southeast Asia’s most successful and respected corporations, the Hong Leong Group, where semiconductors assembly and test has been considered a core business for over 25 years.

The company has three high-technology factories:

Two factories are located in Ipoh, Malaysia, a 90-minute drive from Penang, 2 hours from Kuala Lumpur and has daily flights to Singapore. The factories are supported by extensive R&D and failure analysis staff who incorporate highly sophisticated, “state-of-the-art” equipment to ensure that the quality of our products meet the exacting standards required by the automotive, telecom, computer, and consumer electronics industries.

The China factory, Carsem-Suzhou, Ltd. Which is located in the province of Jiangsu, 50 miles west of Shanghai, started production in 2004. The factory is focused on assembly & test for the MLP-Micro Leadframe Package (QFN Format) and has shipped over 4 billion units worldwide. Carsem-Suzhou offers the identical materials, process and quality standards as the Malaysian factories.

Carsem’s portfolio is at the leading edge of packaging & test technology and is a world leader in the manufacture of the MLP package with over 12 billion units shipped world-wide. The recently introduced ultra small X3 MLP package is the equivalent of the 0201 outline and represents the industries’ smallest MLP production package. Carsem’s SiP (System-in-Package) solution incorporates multiple die and/or passive components assembled in leadframe based format. Carsem’s advanced process solutions include, Flip-Chip on Leadframe (FCOL), Chip on Lead (COL) & Copper Clip/Strap technologies. These three process solutions are offered in the complete range of Carsem’s packages.

All Carsem factories maintain world-class quality standards, having achieved IATF 16949, ISO-9001, ISO-14001, ANSI/ESD S20.20 certifications and comply with the Sony Green Partner Program.

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