Chengdu ESWIN SIC Technology Co., Ltd.

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China International Semiconductor Executive Summit

Attended by

  • CTO
  • Director, Research and Development

Company Profile

Chengdu ESWIN SIC Technology Co., Ltd. is a subsidiary of ESWIN group specializing in Panel Level System Integration Packaging and Testing. Company’s PLP base is located in Chengdu, Sichuan Province. Our company takes the panel level system integration as the core technology and integrates the front and rear end of semiconductor, to provide customers with one-stop, cost-effective customized system solutions.

成都奕斯伟系统集成电路有限公司是奕斯伟集团旗下专业从事板级系统集成封测的子公司,板级封测基地位于四川省成都市。公司以板级系统集成技术为核心,整合半导体前后端,为客户提供一站式、高性价比的定制化系统解决方案。

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