HISILICON

Company Profile

HiSilicon is a globally-leading fabless semiconductor company which was founded in 2004. We provide leading chipset solutions and services for devices used in smart homes, smart cities, smart mobility, and other scenarios.

Our portfolio covers a wide range of fields, including smart vision, smart IoT, smart media, smart transportation, automotive electronics, display, mobile SoC, data centers, and optical transceivers.

Smart vision: Focusing on visual computing, HiSilicon provides advanced solutions for business as well as consumer smart devices which have been widely used in smart city, smart home and much more, featuring industry-leading UHD ISP and computing capabilities, with full development SDK & toolset.

Smart media: HiSilicon provides chipsets and solutions for smart home, smart office, education and commercial scenarios, ranging from set-top boxes (STBs), smart TVs, XR and much more pan-screen smart devices, integrating capabilities from sensing, connecting, computing, and interacting.

Display: HiSilicon provides TCON for large-size displays that feature high reliability and power efficiency, delivering ultra-high resolutions, high frame rates, vivid color, crystal clear, and smooth visual experience to meet consumers’ high demands.

Smart IoT: HiSilicon is devoted to communication technologies, including 5G/4G/NB-IoT in cellular connectivity, Wi-Fi/Bluetooth in short-range wireless connectivity, and HPLC/PLC-IoT in power line communication. Integrating with our other intelligent technologies, we can enable smart IoT devices across all scenarios and industries.

Smart mobiliy: HiSilicon enables intelligent connected vehicles (ICV) and smart transportation facilities. With advanced technologies like smart vision, intelligent interaction, intelligent connectivity, AI, and V2X, we provide solutions and services for the intelligent cockpit, advanced driver-assistance systems (ADAS), ICV and the collaboration between vehicles and roads.

Mobile SoC: HiSilicon delivers an excellent user experience with Kirin high-performance, low-power, and smarter AI mobile chipsets and solutions.

Communications: HiSilicon is the pacesetter across a range of commercially-used mobile communication technologies, including LTE Cat.4, Cat.6, Cat.12/13, Cat.18, Cat.19, Cat.21, dual-SIM dual-VoLTE, C-V2X and pseudo base station defenses. We provide users with fast and reliable connections. We are also the first company to launch 5G commercial terminal chipsets, which are driving development across the 5G industries.

Data center: We have introduced our own ARM server CPU Kunpeng series which delivers high-levels of performance, throughput, integration, and energy efficiency, to meet the diverse computing requirements of data centers. Kunpeng can be used widely in big data, distributed storage, and ARM-native applications.

Accelerating AI industry deployment: HiSilicon’s all-scenario AI solution provides AI Processors with the computing power from the data center to the edge and device. Our AI capabilities can be used for smart cities, smart home, smart manufacturing, smart mobility, cloud services and IT intelligence and etc.

HiSilicon has more than 7,000 employees across 12 offices and R&D centers in Shenzhen, Beijing, Shanghai, Chengdu, Wuhan, Singapore, South Korea, Japan, and Europe. Over more than 20 years of development experience, we have mastered top-tier IC design and verification technologies. We have also optimized our EDA design platforms, development processes, and specifications. Over the years, we have successfully developed more than 200 types of chipsets with intellectual property rights (IPRs), and applied for more than 8,000 patents.

HiSilicon is committed to enabling smart devices across all scenarios. We provide global customers with quality chipsets and solutions, while focusing on excellent service and quick responses. As we go forward, we will continue to create value for our customers.

海思全球领先的Fabless半导体与器件设计公司。前身为华为集成电路设计中心，1991年启动集成电路设计及研发业务，为汇聚行业人才、发挥产业集成优势，2004年注册成立实体公司，提供海思芯片对外销售及服务。致力于为千行百业客户提供智能家庭、智慧城市及智能出行等泛智能终端芯片解决方案。

海思产品覆盖智慧视觉、智慧IoT、智慧媒体、智慧交通及汽车电子、显示、手机终端、数据中心及光收发器等多个领域。智慧视觉领域，凭借全天候超高清图像处理能力、强大的AI算力及高效的算法工具，聚焦视觉感知计算，提供领先的公共安全、智能交通及消费类Camera芯片产品及解决方案智慧IoT领域，深耕5G/4G/NB-IoT蜂窝、WiFi/蓝牙短距无线、HPLC/PLC-IoT电力线等通信技术领域，与其他智能技术相结合，提供全球领先的全场景、全联接的物联网芯片产品与解决方案。

在智慧媒体领域，融合智慧感知、智能计算、智慧联接及极致表达等多种能力，为智慧家庭、智慧办公和商业等多种场景提供强大的融合智能终端，例如智能电视和机顶盒、大中小屏智能终端、XR等解决方案。

在智慧交通及汽车电子领域，通过智能感知、智能交互、联接、AI及V2X等芯片整合优势，面向智能驾驶、智能座舱、智能车联及车路协同等场景推出车规级芯片解决方案及服务，助力汽车产业以及智慧交通产业升级变革，让出行更安全、更舒适、更高效。

在显示领域，以高可信赖性及低功耗为基石，致力于通过大尺寸、高分辨率、高帧率产品及解决方案打造逼真的色彩还原、高清晰度和流畅的视觉效果，满足消费者沉浸式体验的极致追求。

在手机移动终端领域：海思麒麟以高性能、低功耗、更智慧的人工智能移动终端芯片解决方案成就优异的用户体验。

在通信领域：海思巴龙领跑移动通信技术，领先商用LTE Cat.4、Cat.6、Cat.12/13、Cat.18、Cat.19、Cat.21、双卡双VoLTE、C-V2X、伪基站防御等技术，为用户提供高速、可信的联接，率先推出5G商用终端芯片，助力5G产业发展。

在数据中心领域：海思自主设计的ARM架构服务器CPU处理器鲲鹏系列，以高性能、高吞吐率、高集成度、高能效等特点，满足数据中心计算多样化的需求，可广泛应用于大数据,、分布式存储、ARM原生应用等场景。

在加速AI产业部署领域：海思以全场景AI芯片及解决方案昇腾系列，助力AI从中心侧向边缘侧延伸，面向数字中心、边缘、消费终端和IoT场景提供AI算力，为平安城市、自动驾驶、云业务和IT智能、智能制造、机器人等应用场景提供全新的解决方
案。

海思在深圳、北京、上海、成都、武汉以及新加坡、韩国、日本、欧洲等全球设有12个办事处和研发中心，拥有7000多名员工。

经过20多年的发展与积累，海思掌握了国际一流的IC设计与验证技术，拥有先进的EDA设计平台、开发流程和规范，已经成功开发出200多款自主知识产权的芯片，共申请专利8000多项。

海思致力于使能全场景智能终端，为全球客户提供品质好、服务优、响应快速的芯片及解决方案，以客户需求为己任、持续为客户创造价值。