TFME

Company Profile

On August 16, 2007, TongFu Microelectronics Co., Ltd. which was established in October 1997, became a listed company in Shenzhen Stock Exchange. The stock name is “TongFuWeiDian” with code 002156. The company has 2 major shareholders. One is Nantong Huada Microelectronics Group Ltd. (holding 31.25%) and the other is Fujitsu (China) Limited (holding 21.38%). There are 972,630,000 shares in total possessed by the company.

TFME is a corporation specializing in IC assembling and testing, and is China top three IC Package and Test Enterprise. In 2016, TFME ranked 8th globally. The headquarter is located in Chongchuan Zone, Nantong, Jiangsu Province. TFME have 6 production base: Headquarter, Nantong Tongfu, Hefei Tongfu, TF-AMD Suz, TF-AMD Penang, Xiamen Tongfu. Through development and acquisition, TFME has become the local semiconductor multinational corporation and the leader of China IC Package and Test Industry. At present, there are more than 10,000 employees.

At present, TFME owns several packaging technique such as: Advanced Package& Test technology such as Bumping, WLCSP, FC, BGA, SiP etc. Traditional Package& Test technology such as QFN, QFP, SO etc. Automotive Electronics Products and MEMS etc.; Testing technique such as: Wafer Test and System Test. Among domestic package and test corporations, TFME is the first one to realize the mass production of 12inch 28nm mobile phone processor chip backend process, including Bumping, CP, FC, FT, SLT and so on. More than 50% of global top ten semiconductor manufacturers are our major customers.

TFME has several high-level R&D platform such as National Enterprise Technology Center, National Postdoctoral Scientific Research Station, Jiangsu Enterprise Academician Work Station, Provincial Engineering and Technological Research Center and Enterprise research institute. TFME also has a professional technical team formed by more than 2000 people.

As a national and provincial high technology corporation, TFME always stands in the forefront of industry science and technology development, and adheres to the idea of achieving improvement with science and technology. During the past years, TFME has undertaken and completed many national and provincial technological reform projects, such as “02 Special Project”, and got national special funds which worth several billions. Dozens of product technology have been awarded as China Semiconductor Innovative Product and Technology, National Key product, Jiangsu Province High-tech Product and Jiangsu Province Science and Technology awards etc.

Much earlier than its rivals, the company also passed three international management system certifications, including ISO9001, ISO14001 & ISO/TS16949. By using SAP, MES, Equipment Automation, EDI etc., TFME can communicate with customer in real time as per customer’s personalized standard auto-control productive process. Through implementing “TFME Industry 4.0” Project, entirely build the smart plant based on Internet of Things and set up the flexible automation assembly line. Thus, we can create a Win-Win situation for the clients.

The company was established in October of 1997. At present, there are more than 4000 employees. As a national and provincial high technology corporation, TFME always stands in the forefront of industry science and technology development, and adheres to the idea of achieving improvement with science and technology. During the past years, TFME has undertaken and completed many national and provincial
technological reform projects, which effectively promoted the industrialization of advanced assy & test technologies in China. Much earlier than its rivals, the company also passed three international management system certifications, including ISO9001, ISO14001 & ISO/TS16949.

通富微电子股份有限公司成立于1997年10月，2007年8月在深圳证券交易所上市（股票简称：通富微电，股票代码：002156 ）。
公司总股本115370万股，第一大股东南通华达微电子集团有限公司（占股28.35%）、国家集成电路产业投资基金股份有限公司在完成股权交割后将成为第二大股东（占股21.72%），公司总资产120多亿元。
通富微电专业从事集成电路封装测试，是国家重点高新技术企业、中国半导体行业协会副理事长单位、国家集成电路封测产业链技术创新联盟常务副理事长单位、中国电子信息百强企业、中国前三大集成电路封测企业。2017年全球封测企业排名第6位。
通富微电总部位于江苏南通崇川区，拥有总部工厂、南通通富微电子有限公司（南通通富）、合肥通富微电子有限公司（合肥通富）、苏州通富超威半导体有限公司（TF-AMD苏州）、TF AMD Microelectronics (Penang) Sdn. Bhd.（TF-AMD槟城）以及在建的厦门通富微电子有限公司（厦门通富）六大生产基地。通过自身发展与并购，公司已成为本土半导体跨国集团公司、中国集成电路封装测试领军企业，集团员工总数1万2千多人。
通富微电是国家科技重大专项（“02”专项）骨干承担单位，拥有国家认定企业技术中心、国家博士后科研工作站、省级工程技术研究中心、省级院士工作站和企业研究院等高层次研发平台，拥有2000多人的技术管理团队。
通富微电拥有Bumping、WLCSP、FC、BGA、SiP等先进封测技术，QFN、QFP、SO等传统封测技术以及汽车电子产品、MEMS等封测技术；以及圆片测试、系统测试等测试技术。公司在国内封测企业中率先实现12英寸28纳米手机处理器芯片后工序全制程大规模生产，包括Bumping、CP、FC、FT、SLT等。公司的产品和技术广泛应用于高端处理器芯片（CPU 、GPU）、存储器、信息终端、物联网、功率模块、汽车电子等面向智能化时代的云、管、端领域。全球前十大半导体制造商有一半以上是公司的客户。
通富微电在行业内率先通过ISO9001、ISO/TS16949等质量体系。采用SAP、MES、设备自动化、EDI等信息系统，可按照客户个性化的规范自动控制生产过程，实时和客户进行信息交互。实施“通富微电工业4.0”项目，全面构建以物联网为基础的智慧工厂，建立柔性自动化流水线，与客户实现共赢。
通富微电的发展目标，是要成为世界级的集成电路封测企业。在国家政策支持和市场拉动下，在系统厂家的需求牵引、产业链的协同发展、国家产业基金和国家重大专项的支持下，通富微电将不断向着国际级集成电路封测企业的目标迈进。
企业文化内涵：以人为本——在重视个人进步的同时推动企业发展，建设学习型企业，让员工和企业共同成长。
产业报国——以发展中国集成电路封装测试产业为己任，奋发努力，赶超世界先进水平。
传承文明——传承人类优秀的文明成果，树立良好的道德风尚，博爱文明，公平正义。
追求高远——发展无止境，追求更高远，努力向世界级企业不断迈进。
企业愿景：成为世界级的集成电路封测企业通富微电专注于集成电路封测，努力提升产品的设计研发、品质控制、市场营销、资源整合等四种核心能力，逐步靠实力、业绩、贡献树立起“通富微电”品牌。在未来，我们希望成为封测行业的标杆，在核心竞争力、风险管控能力、信息化管理水平、国际知名品牌等方面实现国际先进，实现组织的基业长青，永续经营。
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