Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Amkor Technology, Inc.
As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.
We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.
As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.