Dr. Key Chung

C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.