Dr. Raja Swaminathan photo

Dr. Raja Swaminathan

CVP, Advanced Packaging
AMD
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Biography

Dr. Raja Swaminathan is AMD’s CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design-technology co-optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple’s Mx packages, 3D V-Cache, and the recently announced 3.5D architectures for AI. A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja’s passion for heterogeneous integration is consistently pushing capabilities of silicon.

Company Profile

AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.