Greg Clemons

Sr. Manager Business Development, USA
ASMPT Limited

Biography

Greg Clemons is a seasoned professional with over 27 years in the semiconductor industry. He currently serves as the Senior Business Development Manager at ASMPT SEMI Solutions in the USA, driving business growth and innovation in advanced packaging. His expertise spans silicon wafer fabrication, advanced packaging, and semiconductor equipment. Greg has held key roles throughout his career, starting as a wet etch process engineer at Intel corporation and progressing from wafer fabrication to facilities construction to advanced packaging R&D where he delivered the 1st HVM TCB process for Intel products. He holds seven advanced packaging patents and continues to innovate in fluxless processing development, and has co-authored many technical papers, including a recent publication in enabling HBM 16H stacks with ASMPT Fluxless AOR technology. Greg holds a Bachelor of Science in Mechanical Engineering and a Master of Science in Materials Engineering from the University of Dayton, Ohio while working at the WPAFB Materials Directorate Labs. His leadership and innovation continue to drive advancements in the semiconductor industry.

Company Profile

ASMPT Limited

ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.