Jerome Teysseyre photo

Jerome Teysseyre

VP Package Development & Engineering


Jerome is having 25 years of experience in Package development and engineering.

His career started in Europe with the introduction of BGA , System in Package, embedding and optical camera sensors. Soon after Jerome moved to Singapore to develop southeast Asia packaging center of excellence focusing on next generation wafer level packaging introduction such as E-WLB (fan out).

Jerome transitioned in 2014 to onsemi and power electronics. Jerome’s team are focusing on the development and release to production of differentiated automotive package portfolio and solutions for wide band gap.

Company Profile


onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.