Jim Li, Ph.D.
Biography
- Jim Li (Chung-Li) joined ASE in 1999 as a Sr. engineer for new package development. He served several roles as a manager for design team, modeling and measurement labs, and director for business promotion and Customer Engineering Integration.
- He is now Vice President for Fan-out, Power Module Development and Engineering System Management.
- Jim Li received Ph.D. from Chemical Engineering, Northwestern University, and holds more than 10 patents related to semiconductor packaging.
Company Profile
ASE
ASE is the leading global provider of semiconductor manufacturing services in assembly and test. With a proven track record spanning almost 40 years, ASE today is at the forefront of flexible, powerful, integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are being refined and enhanced to support future generations of system integration. Heterogenous Integration through SiP is enabling significant innovation across dynamic application areas including AI, 5G, automotive, mobile, IoT and more. Our industry is driven by innovation, and through ASE’s miniaturization technologies, we are enabling transformative solutions that are literally changing lives, from health to transportation, from Robotics to AI, from IoT to 5G.
Website: ase.aseglobal.com