Jörg Doblaski photo

Jörg Doblaski



As the Chief Technology Officer of the X-FAB foundry group, Jörg Doblaski is responsible for the development of X-FABs modular CMOS, SOI and WBG processes, targeting automotive, industrial and medical applications. Beside the development of the process technologies, this also includes design kit development, design enablement and customer support as well as prototyping. Jörg joined X-FAB in 2004 and served in different engineering- and engineering management positions before he became the group CTO in 2020. He holds a diploma degree in Electrical Engineering and Information Technology from Technical University of Ilmenau, Germany.

Company Profile


X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial, and medical applications. As a pure-play foundry, X-FAB provides manufacturing and design support services to customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 110 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,200 people worldwide.