Kam Lee
Biography
Kam currently serves as Senior Director at TSMC Advanced Packaging Technology and Service, which he joined in 2022. He specifically manages the TSMC Testing RD, Testing operations and backend turnkey operations. He has extensive experience in semiconductor industry, having worked 27 years at Intel, in various roles in technology development, product development and high volume manufacturing. He previously held the role of Vice President of Intel product development and engineering.
Company Profile
TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.