Marc Mangrum
Biography
Marc joined Amkor in 2010 and currently serves as the Senior Director of the Wirebond/Power Business Unit for Europe, based in Munich, Germany. In this leadership role, he oversees Amkor’s worldwide Power Products Business Unit. Prior to Amkor, Marc held various positions during his 30-year tenure at Motorola and Freescale, where he gained extensive experience in developing new packaging technologies, advanced automatic test equipment (ATE) solutions for digital/analog ICs, and cost-effective IC package design and assembly processes.
A respected subject matter expert, Marc has published over 30 technical papers and holds 34 issued patents. His core competencies span mathematics, electrical engineering, and business administration, complemented by a strong academic foundation from the University of Texas at Austin.
Marc’s deep technical expertise coupled with his business acumen and leadership skills have been instrumental in driving innovation and growth within Amkor’s Power Products portfolio. His contributions have strengthened Amkor’s position as a leading provider of advanced packaging solutions for the power semiconductor market.
Company Profile
Amkor Technology, Inc.
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com