Marc Mangram photo

Marc Mangrum

Senior Director of the Wirebond/Power Business Unit for Europe
Amkor Technology, Inc.


Marc joined Amkor in 2010 and currently serves as the Senior Director of the Wirebond/Power Business Unit for Europe, based in Munich, Germany. In this leadership role, he oversees Amkor’s worldwide Power Products Business Unit. Prior to Amkor, Marc held various positions during his 30-year tenure at Motorola and Freescale, where he gained extensive experience in developing new packaging technologies, advanced automatic test equipment (ATE) solutions for digital/analog ICs, and cost-effective IC package design and assembly processes.

A respected subject matter expert, Marc has published over 30 technical papers and holds 34 issued patents. His core competencies span mathematics, electrical engineering, and business administration, complemented by a strong academic foundation from the University of Texas at Austin.

Marc’s deep technical expertise coupled with his business acumen and leadership skills have been instrumental in driving innovation and growth within Amkor’s Power Products portfolio. His contributions have strengthened Amkor’s position as a leading provider of advanced packaging solutions for the power semiconductor market.

Company Profile

Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.