Matthias Fettke photo

Matthias Fettke

VP Advanced Packaging Equipment
PacTech

Biography

  • Holding a Master´s degree in Laser- and Optical Technology from the University of Applied Science Ernst Abbe in Jena Germany
  • Expertise in integrating optical waveguides into thin glass sheets for photonic packaging and in laser bonding of photonic components acquired during his work at Fraunhofer IZM and IOF
  • He was jointly responsible for the production of the 1st generation of electrostatic chucks for ASML EUV lithography systems and worked for 8 years as leading senior product manager in the E-static Chuck production center in Berlin
  • For more than 10 years he is active in the field of semi-conductor packaging for PacTech. He is a specialist for laser-assisted bonding technologies and holds more than 50 patens and publications

Company Profile

PacTech

PacTech-Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia.

The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).

Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.

The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing, chip singulation, tape & reel services.