Nelson, VP of Business Development, Advance Packaging Technology focuses on High Precision Bonding and “Pick & Place” Solutions for Advanced Packaging. He has worked for more than 30 years in Semiconductor Packaging Industry. Prior to joining ASMPT, he held multiple senior management roles in R&D and manufacturing in both OSAT and design house. He has more than 40 US patents in semiconductor packaging technologies. Nelson holds a Bachelor degree in the field of Electrical Engineering from the University of Colorado at Colorado Springs, USA.
ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.