Quick Tsai

Quick Tsai (Shiann-Tsong Tsai) received a Bachelor’s degree in Physics in Taiwan and a Master’s degree in Electrical Engineering from Syracuse University in 2001. He began his career at UTAC Taiwan, where he worked for nine years as the R&D and Engineering Department Manager. During this time, he pioneered the pressure oven devoid process in die attachment, which laid the foundation for the widespread application of pressure oven technology in assembly processes today.

In 2011, he joined MediaTek as the Technical Manager for Package Technology, where he worked for thirteen years. He led initiatives in multi-tier Cu wire bonding packaging technology, enhancing the performance, cost reduction, and efficiency of semiconductor devices.

He then moved to Whalechip Technology, serving as a consultant and board member for six years. Whalechip Technology, a TSMC partner, accomplished the world’s first computing device using Wafer on Wafer technology. 

Currently, he is the Executive Director at Amazing Cool Technology, where he drives Covetics material innovation and mass production in various areas, including semiconductors. Throughout his career, he has helped companies obtain several patents in numerous area.