Roberto Antonicelli
Biography
Professional with over 25 years of international experience in the semiconductor and automotive sectors. Currently Senior Director at STATS ChipPAC, part of JCET Group, he has previously held leadership roles at STMicroelectronics and Infineon. He holds a PhD in Microelectronics, with a focus on semiconductor packaging and RF/microwave design. His expertise spans business development, strategic partnerships, and complex program execution, with a strong emphasis on business innovation and collaboration. Married and father of three children, he is recognized for his forward-thinking approach to advancing technology and business solutions.
Company Profile
JCET
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.
Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.