Robin Davis is the Director of Business Development at Deca Technologies, an industry leading semiconductor interconnect solutions company. She focuses on identifying new opportunities for the powerful miniaturization and performance benefits of Deca’s M-Series and Adaptive Patterning Technologies. Additionally, she works closely with both internal and customer R&D teams to drive next generation products and technological advances. She is both a contributor and lead inventor on many of Deca’s patents. Previously, Robin fulfilled the role of Senior Solutions Architect at Deca, where she collaborated with customers, suppliers, and Deca’s engineering team to advance package design and interconnect solutions. Robin started her career as a semiconductor packaging engineer at Lattice Semiconductor before transitioning to Advanced Packaging Tools Technical Marketing Engineer at Mentor Graphics (now Siemens EDA). Robin graduated with her BSEE from Portland State University. She is a member of the Tau Beta Pi and IEEE Eta Kappa Nu Honor Societies. Robin also serves as chair of the Diversity, Equity and Inclusivity committee for the International Microelectronics and Packaging Society (IMAPS).
Deca is the semiconductor industry’s leading independent development, implementation and licensing provider of advanced packaging technology offering M-Series, the #1 volume fan-out technology and Adaptive Patterning, empowering designers with breakthrough ultra-high-density interconnect capability.