Roland Rettenmeier photo

Roland Rettenmeier

Senior Manager Product Marketing BU Advanced Packaging


Roland Rettenmeier qualified as a Mechanical Engineer in 1997 and started his professional career with AT&S AG where he worked in different departments, and he was part of the first expat team who helped to build AT&S Shanghai.

Roland completed his MBA studies at Vienna, Austria in 2005. Roland continuously extended his education through other international courses and programs since that time (e.g. Six Sigma Program with AT&S and Nokia; Innovation Technology Leader at Stanford University).

After joining Evatec AG in 2016 as Senior Product Marketing Manager (PMM) within the Business Unit for Advanced Packaging, he focused on business development for Panel Level Packaging where Evatec has now become the recognised market leader for thin film technology solutions. Since 2020 he has also supported development of Evatec’s wafer level packaging business.

In addition to his market and customer responsibilities, Roland is Committee Member and Session Chair of the SEMI Advanced Packaging Conference in Europe and represents Evatec in the Packaging Research Center at Georgia Tech, USA and in the Panel Level Packaging Consortium at the NCAP in Wuxi, China.

Company Profile


Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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