Sung Jin Kim, Ph.D

Dr. Kim is the CTO of Absolics, a spun-off semiconductor packaging business from SK Group in the USA. With 31 years of experience in the semiconductor and microelectronic packaging industry, Dr. Kim leads new technology and business development for advanced semiconductor packaging solutions at Absolics. Prior to Absolics, he held executive positions in various companies and countries, including SKC, Georgia Institute of Technology, Foxconn Advanced Technology, Daeduck Electronics, UTAC, and Amkor Technology. Throughout his career, Dr. Kim managed package engineering, substrate manufacturing, and embedding component microelectronic package engineering. He has over 200 US patents and holds a doctorate in electrical engineering from the Technical University of Dresden, Germany.