Thomas Schmidt
Biography
Thomas Schmidt is Product Manager in the Bonder Division of SUSS MicroTec in Sternenfels. After his graduation in Microsystems Technology at the University of applied sciences in Kaiserslautern he has held various positions in MEMS/semiconductor processing and has also lectured on advanced lithography as well as on MEMS and advanced CMOS fabrication.
Since December 2017 Thomas Schmidt is a member of the Bonder Division of SUSS MicroTec product line “Permanent Wafer Bonding“) with a strong focus on automated cluster platforms for MEMS/packaging applications and hybrid bonding for advanced packaging.
Company Profile
SUSS
SUSS is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS supports more than 8,000 installed systems worldwide. SUSS is headquartered in Garching near Munich, Germany. For more information, please visit suss.com.