Vincent Kim, Ph.D.
Biography
Dr. Vincent (WooPoung) Kim is the Corporate EVP, Head of Packaging at Samsung Device Solutions Research America based in San Jose, California. Dr. Kim is responsible for leading the packaging division at Samsung Device Solutions Research America, dedicated to meeting industry’s needs for advanced chip packaging in high-performance systems. Prior to joining Samsung, he served as a System Architect for Signal Integrity and Power Integrity at Apple, where he played a crucial role in developing consumer computers. Before his tenure at Apple, Dr. Kim worked as an SI Manager in Snapdragon packaging at Qualcomm. Prior to that, he was a Co-Design Engineer in the Wireless Business Unit of Texas Instruments, where he specialized in optimizing the electrical design of OMAP packages and systems. Dr. Kim also gained valuable experience as an SI Engineer at Rambus, where he designed and analyzed memory systems.
Dr. Kim received his Ph.D degree in Electrical and Computer Engineering (ECE) at Georgia Tech in 2004, and his M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.
Company Profile
Samsung Electronics
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.