Viresh Patel photo

Viresh Patel

VP Packaging Technology


  • Vice President of Advance Packaging Technology and Assembly Engineering Operations & Managing all IoT and Infrastructure (IIBU) support (~ $7B Rev) for Renesas World Wide.
  • 35 Years in Semiconductor Industry
  • Prior to being at Renesas, part of the Acquisition of IDT by Renesas(VP , Sr. Dir, Dir) , Maxim (now ADI), Cirrus Logic, and Allegro Microsystem.
  • Hold BS in Mechanical Engineering & Mathematics from University of Massachusetts , Amherst.
  • Hold More than 15 USA and International issued Patents, and have published several articles in Advance Packaging and Thermal management of Semiconductors.

Company Profile


Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.

A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.