Yu-Hua Chen, Ph.D.
VP Carrier SBU/RD Division
Unimicron Technology Corp
Biography
Education:
- Ph.D. Chemistry, 2001, National Taiwan University
Experience:
- 2012~2021, Vice President, Unimicron Technology Corp.
- Advanced substrate, panel level RDL and glass substrate Technology
- 2001~2012, Deputy R&D Director. ITRI/EOSL
- 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
- Chip embedded in rigid and flexible substrate technology
- Flexible LED lighting package technology
Company Profile
Unimicron Technology Corp
Founded in 1990, Unimicron is a world leading company of printed circuit board (PCB) and IC carrier (substrate) manufacturing. Major products include PCBs, high density interconnection (HDI) boards, flexible PCBs, rigid flex PCBs, and IC substrates. Product applications include AI, HPC data center infrastructure (server, networking), smartphones, PC/NB, optical modules, automotive and more. Unimicron’s global footprint encompass manufacturing sites and/or service centers in Taiwan, China, Germany, Japan and Thailand, delivering high value-added, high quality and high productivity innovation and services to our global customers.