Yupeng Xu photo

Yupeng Xu

Forehope Electronic (Ningbo) Co., Ltd.


Xu YuPeng, CTO of FOREHOPE electronic(NINGBO) Co.LTD since June of 2018. 21 years experience in semiconductor assembly house. Before FHEC, Mr Xu has 7 years experience work as VP of ICBU in JCET (2011~2018). and 7 years RND engineer/Manager in Statschippac shanghai(2004~2011). 2 years process engineer in ASE shanghai(2002~2003). Mr Xu experienced with all kinds of IC package assembly process & technology ,especially in SiP integration, Automotive IC , wafer level package development etc.

Company Profile

Forehope Electronic (Ningbo) Co., Ltd.

Forehope(FHEC) was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ,package assembly and testing . The end customer application covered consumer electronics,AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.