Yupeng Xu
Biography
Xu YuPeng, CTO of FOREHOPE electronic(NINGBO) Co.LTD since June of 2018. 21 years experience in semiconductor assembly house. Before FHEC, Mr Xu has 7 years experience work as VP of ICBU in JCET (2011~2018). and 7 years RND engineer/Manager in Statschippac shanghai(2004~2011). 2 years process engineer in ASE shanghai(2002~2003). Mr Xu experienced with all kinds of IC package assembly process & technology ,especially in SiP integration, Automotive IC , wafer level package development etc.
Company Profile
Forehope Electronic (Ningbo) Co., Ltd.
Forehope（FHEC） was founded in Nov 2017, devoted to a worldwide and industry-leading high-end IC ，package assembly and testing . The end customer application covered consumer electronics，AI, industry, Automotive, Network,Data center etc. We can deliver package type include WBQFN, WBLGA, WBBGA, FCCSP, Hybrid-BGA, SiP, MEMS.,QFP, FCBGA etc. And also we can provide wafer level package include Bumping, WLCSP. Forehope continue to research & develop advanced wafer level package like as Fan-out, 2.5D/3D , which for chiplet solutions.