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  • Panel Moderator
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Dr. Bill En

  • CVP, Foundry Technology and Operations
  • AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Dr. Raja Swaminathan

  • CVP, Advanced Packaging
  • AMD

Dr. Raja Swaminathan is AMD’s CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design-technology co-optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple’s Mx packages, 3D V-Cache, and the recently announced 3.5D architectures for AI. A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja’s passion for heterogeneous integration is consistently pushing capabilities of silicon.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Deepak Kulkarni

  • Senior Fellow Advanced Packaging
  • AMD

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

Full Profile
AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Pat Walsh

  • Managing Director NA/EU
  • AMEC

Pat Walsh is a veteran in the semiconductor industry with at least 38 years of experience and currently serves as Managing Director of AMEC handling North America and Europe region. He started his career as a Process Engineer making DRAM chips before switching to GaAs manufacturing as a Member of Technical Staff for defense and aerospace applications. Moving on, he transitioned to work in Semiconductor equipment manufacturing companies like Applied Materials and Lam Research where he progressed from engineering to sales and subsequently executive management. Prior to joining AMEC, Pat was working in a large investment bank managing leasing and financing of semiconductor equipment for clients.

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AMEC

Advanced Micro-Fabrication Equipment Inc. China (AMEC, stock code: 688012) is an innovative Asia-based semiconductor equipment company with a range of proprietary fabrication solutions designed to advance technology, increase productivity, and reduce manufacturing costs for leading global manufacturers of semiconductors and LEDs. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV etch tools, helping chipmakers build devices at process nodes as low as 5nm and beyond. In addition, AMEC’s MOCVD system has become a market leader in China for producers of LEDs and power devices. AMEC products are used today by technology leaders in Chinese mainland and Taiwan region, as well as Singapore, Korea, Germany, Italy and so on.

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Salah Nasri

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ISES

International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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Kamel Ait Mahiout

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

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ISES

International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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Bernhard Knott

Bernhard Knott is the Head of the Infineon Technologies Backend Innovation group. He is responsible for new Package Concepts, Prototyping, new Materials, Simulation and Virtual Prototyping. Until 2016 he was leading the Package Development for Sensors and Waferlevel Package Development in Regensburg, Germany. Prior joining the Backend Organization, he held several Management Position in Frontend Technology dealing with BiCMOS Technologies, Sensors and Innovation projects. After receiving his Diploma in Physics from the University of Regensburg, he started his career in Semiconductor Industry in 1997 in developing an embedded NVM Technology. Bernhard holds several patents and patent applications in the area of FE Technology, Sensors and Packaging.

Bernhard Knott is the Head of the Backend Innovation group at Infineon Technologies AG, Germany. After receiving his Diploma in Physics, he started his career in Semiconductor Industry in 1997 in Frontend and later in Backend Technology Development. Bernhard holds several patents and patent applications in the area of FE Technology, Sensors and Packaging.

 

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Dr. Thomas Morgenstern

Thomas Morgenstern is Executive Vice President of Infineon Technologies AG. He was born in Mosbach (Germany) in 1968. Thomas Morgenstern studied chemistry at the Heinrich-Heine-University Duesseldorf and received his PhD in 1998. He started his career in 1998 at Semiconductor 300. Before joining Infineon again in 2021, he held various positions at Biotronik SE & Co KG, BOSCH and Globalfoundries.

Positions within the company

  • Since 2022 Head of Frontend
  • 2021 Managing Director Dresden

Further positions

2017-2020 2013-2017
2010-2013 2009-2010
1998-2009
Globalfoundries Dresden

Senior Vice President and General Manager Fab 1
BOSCH Reutlingen and Souzhu

Senior Vice President Manufacturing and Technology
Globalfoundries Dresden Director Engineering

Biotronik SE & Co KG
Director Manufacturing Active Implants

Qimonda/ Infineon Dresden
Managing functions in various positions

Membership of Supervisory Boards

Infineon Technologies Dresden Verwaltungs GmbH, Neubiberg, Germany (Head of Supervisory Board)

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Mark Nils Münzer

Mark Muenzer received the Dipl.-lng. degree in electrical engineering from the RWTH Aachen, Germany, in 1997. As a development engineer for industrial power modules at Eupec GmbH he established industry leading power modules. In 2005 Mark transferred to Infineon Headquarter in Munich where he build up Infineon’s ElectricDriveTrain business. He initiated new product families for automotive power modules and related driver ICs. As a senior director Mark Muenzer was from 2012 until 2018 responsible for the newly found business segment EDT-Electric Drive Train. 2018 Mark Muenzer took over a position as Vice President for Innovation & Emerging Technologies in the Automotive High Power business line of Infineon. In September 2022 Mark was promoted to Distinguished Engineer.

Full Profile
Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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CS Chua

CS Chua oversees regional sales, marketing and distribution, supply chain, R&D, and manufacturing. He is also responsible for strategy, quality management, human resources, and communications for the Asia Pacific region with local presence in Australia, India, Indonesia, Korea, Malaysia, Philippines, Thailand, and Vietnam. He has held the current role since 2017. CS joined Infineon in 2000 and has taken on roles in product marketing for industrial microcontrollers and regional marketing covering Asia Pacific’s automotive electronics segment. Previously as the Vice President of Automotive Regional Centre. CS has a Bachelor of Electrical and Electronics Engineering degree from the Nanyang Technological University in Singapore.

Full Profile
Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Dr. Gunar Lorenz

Dr. Gunar Lorenz is currently heading the technical marketing and application engineering for consumer sensors at Infineon Technologies. Gunar joined Infineon in 2016 as system project manager responsible for Infineon’s first open market MEMS microphone. Prior joining to Infineon he worked as director of system-level simulation at Coventor, where he and his group invented and developed Coventor’s MEMS/IC co-simulation design environment MEMS+. The original ideas for MEMS+ are embodied in his PhD carried out at Robert Bosch R&D Center in 1999. Gunar graduated in mechanical engineering at the TU Braunschweig in Germany and received his PHD in electrical engineering from the TU Bremen in 1999.

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Infineon Technologies AG

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Steve Pawlowski

Steve Pawlowski is corporate vice president of advanced computing solutions at Micron Technology. He is responsible for defining and developing innovative memory solutions for the enterprise and high-performance computing markets.

Prior to joining Micron in July 2014, Steve was a senior fellow and the chief technology officer for Intel’s Data Center and Connected Systems Group. His extensive industry experience includes 31 years at Intel, where he held several high-level positions and led teams in the design and development of next-generation system architectures and computing platforms.

Steve earned bachelor’s degrees in electrical engineering and computer systems engineering technology from the Oregon Institute of Technology and a master’s degree in computer science and engineering from the Oregon Graduate Institute. He also holds 58 patents.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Amarjit Sandhu

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Naga Chandrasekaran

Naga Chandrasekaran is senior vice president of technology development at Micron Technology. Dr. Chandrasekaran leads Micron’s global technology development and engineering efforts related to the scaling of current memory technologies, advanced packaging technology, as well as investigating emerging memory technology solutions to support Micron’s future requirements. He also manages mask technology development, corporate characterization labs, advanced modeling and data analytics, and R&D fabrication operations at Micron’s headquarters in Boise, Idaho. He was appointed to his current position in 2019.

In 2001, Dr. Chandrasekaran joined Micron as a CMP development engineer and since then has held a series of positions of increasing responsibility in process and equipment development across multiple R&D process areas, leading manufacturing and technology transfer efforts, integration of new business units, and development of solar, LED and display technology. From 2007 to 2008, he also served as fab engineering manager for IM Flash, Singapore Operations. He most recently served as senior vice president of process research and technology development.

Dr. Chandrasekaran has authored several keynote publications and patents, and he has served as an invited panel speaker at several conferences. He has also received several awards, including Jiri Tlusty Outstanding Young Manufacturing Engineer of the Year, awarded by the Society of Manufacturing Engineers in 2003, and Engineering Manager of the Year, awarded by the American Society of Engineering Management (ASEM) in 2018.

Dr. Chandrasekaran earned a bachelor’s degree in mechanical engineering from the University of Madras. He earned both a master’s and a doctorate degree in mechanical engineering from Oklahoma State University and dual executive MBAs from the University of California, Los Angeles (UCLA-Anderson School of Management) and the National University of Singapore.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Dr. Jun He

  • VP Quality & Reliability, Advanced Packaging Technology & Service
  • TSMC

Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.

Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Kam Lee

  • Deputy Head of TSMC Advanced Packaging Technology and Service
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Siobhan Das

SIOBHAN DAS Chief Executive Officer American Malaysian Chamber of Commerce Siobhan Das joined the American Malaysian Chamber of Commerce (AmCham Malaysia) as its Executive Director in 2016 and was promoted in 2020 to become the organization’s first Chief Executive Officer in its 43 year history. Siobhan has created an action-oriented policy platform at the Chamber that is designed to address both the strategic concerns of American multinational companies and the tactical day-to-day challenges faced by operations on the ground. By working closely with business leaders and various stakeholders in the Malaysian and U.S. governments, Siobhan has been able to represent the membership and ensure that AmCham Malaysia fulfills its role as the Voice of U.S. Businesses in Malaysia. Siobhan spent 11 years in Shanghai, five of which as a director at AmCham Shanghai. Siobhan is a Sloan Fellow from London Business School with a Masters in Leadership and Strategy; she also holds two undergraduate degrees from Boston University in Broadcasting and Film, and English. She enjoys golf and is still reveling in her first hole-in-one (2023)!

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American-Malaysian Chamber of Commerce (AMCHAM)

The American Malaysian Chamber of Commerce (AMCHAM) was founded in 1978 as an international, non-profit, private-sector business association. It comprises more than 1200 members representing about 290 American, Malaysian, and other international companies. The Chamber is a member of the AmChams of Asia Pacific (AAP) a non-governing association of 27 AmChams in the region that come together to support engagement in the Asia Pacific.

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Walter Chen

Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Jianmin Li

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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George Harris

George joined Amkor in 2020 and is currently responsible for Global Test Services operations. Prior to joining Amkor, George led teams and factories for II-VI Inc on VECSEL GaAs products for 3D imaging and preceding that spent 30 years at Texas Instruments engaged in work on memory, analog and SOC products. He holds six US and EU patents on circuit design, wafer fab processing, test and manufacturing controls. George earned masters and bachelor’s degrees in electrical engineering from Syracuse University.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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David Clark

David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Prior to joining Amkor, David has held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted 5 patents in Optoelectronics and Device Packaging and holds a BEng Honors Degree in Electronic, Electrical and Optoelectronic Engineering from University of Glasgow.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Adrian Arcedera

Adrian joined Amkor in 1997, and is currently Sr VP for Memory, MEMS and Sensor Business Unit, responsible for the business and platform development for Memory, MEMS & Sensor Products. He has served in various leadership positions in Amkor’s chip scale products, including leading the platform development for Amkor’s ChipArray® package. He has authored multiple technical papers and has been granted multiple US Patents. He holds a degree in chemical engineering from the University of the Philippines.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Dr. JinYoung Khim

JinYoung joined Amkor Technology in 2000 and is currently Sr. Vice President, Global R&D Strategy. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Curtis Zwenger

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Dato Seri Lee Kah Choon

Dato’ Seri Lee Kah Choon is currently the Independent Non-executive Chairman of Aemulus Holdings Berhad, a company listed on Bursa Malaysia, which engages in the design & assembly of automated test equipments in the electronic industry.

He is the Chairman of Federal Oats Mills, South East Asia’s largest oats manufacturer producing quality oats & oats based products for the Asian, Middle East and African markets.

Dato Seri Lee also sits on the boards of Nationgate Holdings Berhad & L&P Global Berhad (both listed on Bursa Malaysia) as their Senior Independent Director.

Additionally, Dato Seri Lee is a member of the Investment Committee of Areca Capital, a licensed fund manager for individuals, corporations and institutions.

Industries covered by these companies include: electronic testing equipments manufacturing; electronic manufacturing services; box & crate packaging; food production; wealth management.

Dato Seri Lee had served as board member of various federal & state government linked companies & corporations; Parliamentary Secretary; Member of Parliament & Municipal Councillor.

He was a practicing lawyer with his own private legal practice from 1987 to 2004, after being called to the Bar of Malaya in 1987 and Bar of England & Wales in 1986.

Dato’ Seri Lee holds a LLB from the Southampton University, UK and a MA from the City University, London.

Dato Seri Lee is a Barrister at Law (Middle Temple) & a Certified Financial Planner.

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Aemulus

TBC

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Angeline Tee

Angeline Tee has over 25 years of international experience in the Semiconductor and MEMS industry. Currently serving as the Business Development Deputy Director at IME, ASTAR, Angeline actively engages with industry leaders and identifies business development opportunities to create and capture value for industry partners and contribute to Singapore’s economy.

Angeline has earned an Honor’s degree in Bachelor of Applied Science (Materials Engineering) and a Master of Science (MSc) in Electrical Engineering from the National University of Singapore (NUS). Furthermore, she holds a Master of Business Administration (MBA) from the University of Birmingham, which adds a strategic and managerial perspective to her skill set.

Her career in MEMS began at EG&G Heimann Optoelectronics, where she successfully commercialized the MEMS accelerometer for automotive airbag applications. Throughout her professional journey, Angeline has gained extensive experience in various areas, including research and development, process engineering, marketing, and business development. She has worked with both small start-up companies and large corporations, accumulating a wealth of knowledge and expertise in the field. Angeline’s technical proficiency in MEMS technology led her to assume the role of product marketing manager at GLOBALFOUNDRIES where she spearheaded the business development of GLOBALFOUNDRIES’s newly setup MEMS BU in 2010. Subsequently, she joined XFAB in Germany, and played a pivotal role in China regional marketing, supporting the sales team in market expansion.

With her diverse skill set, extensive industry experience and strong academic background, Angeline hopes to contribute significantly to both technological advancement and innovation creation in the MEMS industry.

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A*Star IME

Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.

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Dr. Yul Koh

Graduated from the Department of Electrical and Electronic Engineering at Seoul National University in Korea. Following graduation, he embarked on a journey of research at LG Electronics Sensor Solution Lab, where he focused on the developing of MEMS sensor platform and its application in products. Afterward, he assumed his current position at the Institute of Microelectronics in Singapore, where he delved deep into research at the acoustic MEMS device. His expertise spans a wide spectrum, from MEMS devices to sensor solutions, acquired through 15 years of experience in the field. He is currently engaged in various research and development initiatives in the field of piezoelectric micromachined ultrasound transducers and low-power MEMS switches.

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A*Star IME

Established in 1991, the Institute of Microelectronics (IME) is a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). In IME, we focus on delivering high impact research and development for the global semiconductor industry. IME’s role is to collaboratively develop and innovate next-generation technologies to enable a dynamic semiconductor ecosystem. Together with our highly skilled talent pool, we develop strategic capabilities and innovative technologies through state-of-the-art infrastructure. IME’s core research areas are in Advanced Packaging, piezoMEMS, SiC, mmWave GaN, and photonics & sensors. We will continue to shape the semiconductor industry’s roadmap for many years to come.

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Dr. Abderrazzaq Ifis

  • Engineering Director
  • AT&S

As Engineering Director, Dr. Abderrazzaq Ifis is leading the new AT&S IC-Substrate plant qualification and ramp-up in Kulim. He has over 13 years of engineering experience in developing and manufacturing innovative and high-end technologies and products. Dr. Ifis hold a Ph.D. in Mechanics of Materials and Ing. degree in Processes Engineering from prestigious Moroccan and French institutions. Abderrazzaq and his family have been relocated to Malaysia in 2022, seeking not only career development but also exploring life in a joyful, rich and diversified culture and environment here.

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AT&S

AT&S has chosen Malaysia for its pioneer production site in Southeast Asia. With a planned total investment of €1.7 billion (RM8.5 billion) over the next 6 years, this is by far the largest investment in the corporate history of AT&S. The new campus of AT&S is being built at Kulim Hi-Tech Park, which is approximately 350km north of the capital city, Kuala Lumpur. The ongoing construction work started in November 2021 and the start of series production is tentatively scheduled for the end of 2024.

At AT&S Kulim site, there are 3,000 – 4,000 construction workers performing different tasks at site to deliver the fast track construction progress. This manufacturing facility, once completed, will be responsible for the production of high-end IC substrates for high-performance processors at the location in Southeast Asia. These processors are primarily used in high-performance computers, data centres, gaming, 5G, automotive and Artificial Intelligence (AI).

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Arjun Kumar Kantimahanti

Arjun is an R&D Engineer with Broadcom Inc. He is presently working on Silicon Photonics.

Formerly, Arjun was the SVP of Technology Development (TD) and Design Technology (DT) departments at SilTerra Malaysia Sdn Bhd. He has been with SilTerra since 2001 and has been instrumental in setting up various technologies at SilTerra.

He has a total experience of 29 years in Semiconductor Foundry and throughout his career has been working in Technology Development.

He has experience in leading various teams to develop technologies from the start and take them through various phases (such as feasibility, prototyping, qualification, risk release and full production ramp). He has worked on various technology nodes starting from 0.6um through 80nm covering High Voltage, Logic, RF, Mixed Signal, BCD, Flash, MEMS, Silicon Photonics and others.

He also experience in leading the Design Technology group to develop key capabilities such as RF modeling, PDK and library development.

Arjun holds a Master’s degree in Microelectronics from Texas A&M University, USA and a Bachelor’s degree in Electrical and Electronics from Sri Venkateswara University, India.

He has been granted 7 US patents and authored various technical publications.

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Broadcom

Coming soon…

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