Dr. Raja Swaminathan photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Raja Swaminathan

  • CVP, Advanced Packaging
  • AMD

Dr. Raja Swaminathan is AMD’s CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design-technology co-optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple’s Mx packages, 3D V-Cache, and the recently announced 3.5D architectures for AI. A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja’s passion for heterogeneous integration is consistently pushing capabilities of silicon.

Full Profile
AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Full Profile
Deepak Kulkarni photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Deepak Kulkarni

  • Senior Fellow Advanced Packaging
  • AMD

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

Full Profile
AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Full Profile
Mark Fuselier photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Mark Fuselier

  • SVP Technology & Product Engineering
  • AMD

Mark Fuselier is senior vice president of Technology and Product Engineering at AMD.

He is responsible for silicon and packaging technology development and new product introduction engineering.

Fuselier has more than 27 years of semiconductor industry experience and has been involved in the development and production of process technology generations spanning from 35 micron through 3nm across multiple fabs and product families. He played a central role in the development and productization of computing solutions such as multi-core CPU and GPU SoC integration, heterogenous APUs, 2.5D and 3D chip-packaging, and chiplet System in Package (SiP) integration.

Fuselier holds a Master of Science degree in electrical engineering and Master of Business Administration from the University of Texas at Austin. He is a member of IEEE and the Electron Devices Society.

Full Profile
AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Full Profile
Dr. Bill En photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Bill En

  • CVP, Foundry Technology and Operations
  • AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

Full Profile
AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

Full Profile
Ken Shibata photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Ken Shibita

Ken Shibata has been immersed in the semiconductor industry since 1980. He initiated his career at a manufacturing company within Hitachi Semiconductor Division, where he spent the first decade as a backend assembly process engineer. Over the subsequent 10 years, he played a pivotal role in promoting the OSAT business. From 2001 to 2014, Ken contributed significantly to Amkor Technology Japan, ultimately holding the position of Representative Director and Sales VP. Following this, he served as Representative Director and Senior Vice President at UTAC Japan from November 2014 to June 2019. Ken joined ISES on October 15, 2023.

Full Profile
ISES

International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

Full Profile
Shigeru Shiratake photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Shigeru Shiratake

Shigeru Shiratake is the Corporate Vice President for Technology Development’s DRAM and Emerging Memory research development organization. Shiratake joined Micron in 2013 as the Section Director of the DRAM process integration organization. Prior to joining Micron, Shiratake was an executive of Elpida Memory (acquired by Micron in 2013) between 2005 – 2013, leading several DRAM programs. Shiratake experience spans 35 years in the memory technology sectors, and includes additional leadership positions with Renesas Technology Inc., and Mitsubishi Electric, Corp. Shiratake is a published author of many technical papers, holds dozens of patents pertaining to semiconductor technology.

Full Profile
Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Full Profile
Dr. Akshay Singh photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Akshay Singh

Dr. Akshay Singh is Vice President of Advanced Packaging Technology Development at Micron. He joined Micron in 2006. He leads a global team that is responsible for delivering advanced memory packaging solutions for compute, storage, mobile and embedded markets. Prior to joining Micron, Akshay worked at a startup developing actuators and sensors based on novel electroactive polymers. Akshay holds master and doctoral degrees in mechanical engineering from Louisiana State University in US and bachelor degree in mechanical engineering from Maharaja Sayajirao University in India.

Full Profile
Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Full Profile
Micron logo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Bret Street

Full Profile
Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Full Profile
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Kathy Yan

Full Profile
TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

Full Profile
Kam Lee photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Kam Lee

  • Deputy Head of TSMC Advanced Packaging Technology and Service
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

Full Profile
TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

Full Profile
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Douglas Yu

  • VP R&D and Distinguished Fellow
  • TSMC
Full Profile
TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

Full Profile
KC Hsu photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

K.C. Hsu

  • VP, Research & Development / Integrated Interconnect & Packaging
  • TSMC

Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. He possesses more than 30 years’ experience in the semiconductor industry.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University and his M.S. in Technology Management from National Chiao Tung University.

Full Profile
TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

Full Profile
Ji Park photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Ji Park

Ji joined Amkor Technology in 2016 and presently holds the position of Senior Vice President for the Memory Business Unit. In this role, he oversees business and platform development for Memory Products. Ji brings a wealth of experience, having held leadership positions at Qualcomm, Renesas (IDT), Integrated Circuit Systems, and Texas Instruments. He is an accomplished professional, having authored numerous technical papers and being granted four patents. Ji holds a degree in electrical and electronics engineering from the University of Texas at Austin and earned his MBA from the University of Dallas.

Full Profile
Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

Full Profile
Walter Chen photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Walter Chen

Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.

Full Profile
Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

Full Profile
Katsumi Furuse photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Katsumi Furuse

Since joining Amkor Technology in 2020, Katsumi has demonstrated his expertise through various roles within the Power Product Business Unit in Japan. As a dedicated product manager, he has played a pivotal role in the development of power products for diverse clientele in both Japan and international markets. With 22 years of experience in product engineering, development, marketing, planning, and project management within the power device industry, Katsumi brings a wealth of knowledge to his current position. He holds a Bachelor of Science degree in Information and Communication Engineering from a university in Miyagi, Japan.

Full Profile
Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

Full Profile
Dr. Hamid Azimi photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Hamid Azimi

  • Corporate VP, Director of Substrate Packaging TD
  • Intel

Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.

Full Profile
Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Full Profile
Jackie Sturm photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Jackie Sturm

  • CVP Global Supply Chain Operations
  • Intel

Jackie Sturm leads operations for Intel’s multi-billion-dollar Global Supply Chain, which has been cited as a #8 or better for nine consecutive years in Gartner’s Supply Chain Top 25. Her international team supports Construction and Facilities sourcing, Indirect procurement, business continuity, supply chain systems and analytics, and Supply Chain Environmental and Social Governance program, which includes Intel’s first-mover Conflict Minerals initiative. Jackie is a committed advocate for the criticality of value-added manufacturing, engineering and trade as the economic foundations of thriving societies. Within Global Supply Chain, Jackie sponsors targeted advancement programs to address challenges faced by women and unrepresented minorities in technology.

Jackie is a board director for KM Labs and on the board of advisors for Banff International Research Station, Gartner/SCM Word, Howard University Center for Supply Chain Management, and Women’s Business Enterprise National Council (WBENC). Prior to joining supply chain, Jackie held various finance positions at Intel, including CFO for Technology and Manufacturing, as well as at Hewlett Packard, Ridge Computer, and Apple.

Full Profile
Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Full Profile
Ann Kelleher photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Ann Kelleher

  • EVP & GM Technology Development
  • Intel

Dr. Ann Kelleher is the executive vice president and general manager of Technology Development at Intel Corporation. Since 2020, she is responsible for the research, development and deployment of the next-generation silicon, advanced packaging, and test technologies that power Intel’s innovation. She joined Intel in 1996 as a process engineer and has worked in areas spanning from litho, thin films, yield, to managing all of Intel’s Global operations including Fab and Assembly Test factories, supply chain and construction. She did her Ph.D. in electrical engineering from University College Cork in Ireland and her post-doc at IMEC.

Full Profile
Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Full Profile
Dr. Ravi Mahajan photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Ravi Mahajan

  • Intel Fellow, Assembly and Packaging Technology Pathfinding
  • Intel

Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE. He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.

Full Profile
Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Full Profile
Rahul Manepalli, Ph.D. photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Rahul Manepalli, Ph.D.

  • Intel Fellow; Director Substrate TD Module Engineering
  • Intel

Rahul Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization in Intel. Rahul and his team are responsible for developing next generation of materials, processes and equipment for Intel’s package pathfinding and development efforts. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) and other substrate technologies. Rahul has also had an instrumental role in leading Intel’s assembly materials development and pathfinding efforts leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 100 patent publications in semiconductor packaging, over 50 technical papers and invited talks and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

Full Profile
Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

Full Profile
Chance Finley photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Chance Finley

  • VP Global Supply Chain Operations
  • onsemi

Chance Finley has over 13 years of experience in the semiconductor industry. He is currently the Vice President of Supply Chain Management at onsemi, where he is leading an end-to-end supply chain transformation. Previously, he worked as Chief of Staff for Connected Secure Systems division at Infineon Technologies in Munich, Germany. Chance joined Infineion through the acquisition of Cypress Semiconductor, where he spent 10 years building progressive leadership responsibility within the supply chain. Chance graduated from the University of California, Santa Barbara with a degree in Business Management Economics.

Full Profile
onsemi

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Full Profile
Joseph Roybal photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Joseph Roybal

  • Senior Vice President of Global Backend Operations
  • Wolfspeed

Joseph Roybal is the Senior Vice President of Global Backend Operations at Wolfspeed aligning backend manufacturing roadmaps, production strategies, and capital allocation to scale efficiently with Wolfspeed’s exponential growth. He leads an expanding worldwide team focused on systemic manufacturing solutions, SiC package innovation, strategic partnerships with OSATs, and effective product manufacturing solutions for all Wolfspeed businesses and major SiC backend operations.

Full Profile
Wolfspeed

Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.

Wolfspeed® is a registered trademark of Wolfspeed, Inc.

Full Profile
Ben Kozy photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Ben Kozy

Ben Kozy is the Chief Operating Officer of Airspace, a tech-enabled, time-critical logistics company headquartered in Carlsbad, CA with offices in the US and Europe. Airspace works with clients requiring the most expedited shipments, including organs for transplant and airlines requiring replacement parts before departure. Prior to Airspace, Mr. Kozy spent nearly five years at McKinsey working with various transportation and logistics companies throughout the United States, where he led teams across a range of operationally-focused projects. He earned an MBA from Columbia Business School and a Bachelor of Science in systems engineering from the U.S. Naval Academy.

Full Profile
Airspace

Whether your production line is facing a shutdown, or your high-value equipment is waiting for a new component, you can’t afford a shipping delay. From life-saving organs to essential machinery components, Airspace is trusted by the world’s largest companies and most critical organizations to move their top time-sensitive shipments on time, every time.

Airspace’s proprietary AI-powered platform is the most advanced of its kind- awarded and protected by multiple patents, it provides speed, reliability, routing, tracking visibility and transparency unrivaled in time-critical logistics. It powers a 24/7/365 pro-active expert support team that understands the needs of vertical specific shipments such as those in the semiconductor business.

With offices in the United States in Southern California, Dallas, and in Europe in Amsterdam and new offices in Frankfurt, Stockholm, and Paris, London, Porto, Airspace is rapidly scaling into new markets and industries while continuing to innovate and maximize value for its customers. Backed by leading investors including Telstra, HarbourVest, Prologis, Qualcomm, Defy, and others, Airspace has raised $70M to date.

Full Profile
Marco Pratillo photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Marco Pratillo

  • Sales Manager Semi & MEMS Test Equipment BU
  • SPEA

Marco Pratillo received his M.S. degree in Electrical Engineering from the Polytechnic of Turin (Italy) in 2012. He promptly joins SPEA as part of the Product and Test Engineering Group in Electronic Industries and Custom Semiconductor Test Equipment. Starting from 2017, he relocated to Suzhou (China) as Test Engineering Manager Mems and Power Semiconductor, where he contributed to the exponential growth of the Semiconductor Division, Power and MEMs. He spent five years working closely with the Sales team aiming to affirm and expand the presence of SPEA’s products. In 2022, Marco returned to Italy in the role of Technical Sales Manager, specifically dedicated to the biggest Semiconductor manufacturing leaders in Asia.

Full Profile
SPEA

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

Full Profile
Jeffrey Wincel photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Jeffrey Wincel

Jeff is an international purchasing executive recognized as an industry leader. He is a published author with six books to his credit. Jeff has been selected as one of the “Pros to Know” by Supply & Demand Chain Executive Magazine in 2002, 2004, 2007, 2012 and was a recipient of a team award in 2013 and 2015. Jeff is currently the senior vice president and chief procurement office at NXP Semiconductors, and formerly held the role as the corporate vice president, chief procurement officer at Advanced Micro Devices (AMD). He also served as faculty associate of supply chain management at Arizona State University, W.P. Carey School of Business. Previously, Jeff was the vice president, chief procurement officerat ON Semiconductor, senior director of integrated supply chain at Honeywell Aerospace; founder and president of LSC Consulting Group – an independent professional consulting service specializing in lean supply chain management; vice president and general manager modular systems, and vice president corporate procurement and materials for Donnelly Corporation; and director of worldwide purchasing for TRW.

Full Profile
NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) brings together bright minds to create breakthrough technologies that make the connected world better, safer and more secure. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets while delivering solutions that advance a more sustainable future. Built on more than 60 years of combined experience and expertise, the company has approximately 34,200 team members in more than 30 countries and posted revenue of $13.28 billion in 2023. Find out more at www.nxp.com.

Full Profile
Dr. Monita Pau photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Monita Pau

Dr. Monita Pau is Strategic Marketing Director for Advanced Packaging at Onto Innovation. Prior to joining Onto, she held various application engineering, marketing and strategic business development roles at DuPont and KLA. Her expertise spans across FOEL/BEOL process control solutions as well as advanced packaging and assembly materials serving both core and specialty semiconductor markets. Dr. Pau holds a Ph.D. degree in Chemistry from Stanford University.

Full Profile
Onto Innovation

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

Full Profile
Toshihito Tsuga photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Toshihito Tsuga

Toshihito Tsuga is General Manager of the Regional Account Division. He joined Onto Innovation Japan (Nanometrics Japan) in 2019 as Sales Manager. Prior to joining Onto Innovation, he was Product Manager at KLA Japan from 2005 to 2019. Tsuga has over 30 years of experience in Semiconductor industry, including at IC device makers as process engineer at Texas Instrument Japan, Renesas Technology Inc.,. Tsuga received ph. D degree from Tohoku University.

Full Profile
Onto Innovation

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.

General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com

Full Profile
ST Liew photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

ST Liew

  • President, Taiwan & SEA Australia, New Zealand Vice President
  • Qualcomm

ST Liew is a Vice President of Qualcomm Technologies, Inc. and the President of Qualcomm Taiwan and South East Asia, Australia, New Zealand. ST was born in Malaysia and was educated in Malaysia, Singapore and the UK. His permanent home is Singapore.

In this role, ST is responsible for leading all business and operational functions for Qualcomm in the region. Prior to this role, ST served as the Vice President and President of Qualcomm Taiwan.

ST has more than 30 years of experience leading businesses and R&D in the telecommunication industry. Most recently ST was the President of Acer’s new Business Group SPBG that focused on R&D and Sales of non PC lines of product for the global market while living in Switzerland and later in Taiwan.

Before joining Acer, ST was in Motorola for over 18 years leading Regional R&D Teams and later in Product planning, business Teams across the world in products ranging from Mobile radios, Pagers, Data terminals to Cellular phones. ST has lived in China, Korea, USA and India during his tenure.

Liew received his MBA from the National University of Singapore, and holds a BSc. in Electrical and Electronic Engineering from the University of Leeds, UK.

Full Profile
Qualcomm

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

Full Profile
Dr. Seungwook Yoon photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Dr. Seungwook Yoon

Dr. YOON is currently working as Corporate VP/Business Development Team, AVP, Samsung Electronics

Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. YOON received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

Full Profile
Samsung Electronics

Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

Full Profile
Oreste Donzella photo
  • Keynote Speaker
  • Panel Moderator
  • Speaker
  • Virtual Speaker
  • Panelist
  • Co-Chair
  • Headline Address

Oreste Donzella